Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Microelectronic die packages, stacked systems of die packages, and methods of manufacturing them are disclosed herein. In one embodiment, a system of stacked packages includes a first die package having a bottom side, a first dielectric casing, and first metal leads; a second die package having a to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BOON SUAN JEUNG, ENG MEOW KOON, CHIA YONG POO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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