Integrated circuit packaging system having dual sided connection and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KO CHAN HOON, KIM YOUNGCHUL, PARK SOO-SAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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