Ultra slim RF package for ultrabooks and smart phones

A semiconductor device package having reduced form factor and a method for forming said semiconductor device are disclosed. In an embodiment, an active die is embedded within a cavity in the core layer of the package substrate, wherein an in-situ electromagnetic shield is formed on the sidewalls of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HACKITT DALE A, HANNA CARLTON E, NAIR VIJAY K
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS
Online-Zugang:	Volltext bestellen
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