Metal wire etchant and method of forming metal wire using the same
A metal wire etchant including persulfate, a sulfonate, a fluorine compound, an azole-based compound, an organic acid, a nitrate, and a chlorine compound, and a method of making the same.
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| creator | KIM GYU-PO SHIN HYUNOL CHOUNG JONG-HYUN SEO WON-GUK KIM IN-BAE LEE KI-BEOM HAN SEUNG-YEON PARK HONG SICK JEONG JAE WOO KIM SEON-II CHO SAM-YOUNG |
| description | A metal wire etchant including persulfate, a sulfonate, a fluorine compound, an azole-based compound, an organic acid, a nitrate, and a chlorine compound, and a method of making the same. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8889032B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8889032B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8889032B23</originalsourceid><addsrcrecordid>eNrjZHDyTS1JzFEozyxKVUgtSc5IzCtRSMxLUchNLcnIT1HIT1NIyy_KzcxLB4nAFJYWgwRKMlIVihNzU3kYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSXxosIWFhaWBsZGTkTERSgCcmTFK</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Metal wire etchant and method of forming metal wire using the same</title><source>esp@cenet</source><creator>KIM GYU-PO ; SHIN HYUNOL ; CHOUNG JONG-HYUN ; SEO WON-GUK ; KIM IN-BAE ; LEE KI-BEOM ; HAN SEUNG-YEON ; PARK HONG SICK ; JEONG JAE WOO ; KIM SEON-II ; CHO SAM-YOUNG</creator><creatorcontrib>KIM GYU-PO ; SHIN HYUNOL ; CHOUNG JONG-HYUN ; SEO WON-GUK ; KIM IN-BAE ; LEE KI-BEOM ; HAN SEUNG-YEON ; PARK HONG SICK ; JEONG JAE WOO ; KIM SEON-II ; CHO SAM-YOUNG</creatorcontrib><description>A metal wire etchant including persulfate, a sulfonate, a fluorine compound, an azole-based compound, an organic acid, a nitrate, and a chlorine compound, and a method of making the same.</description><language>eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NATURAL RESINS ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141118&DB=EPODOC&CC=US&NR=8889032B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141118&DB=EPODOC&CC=US&NR=8889032B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM GYU-PO</creatorcontrib><creatorcontrib>SHIN HYUNOL</creatorcontrib><creatorcontrib>CHOUNG JONG-HYUN</creatorcontrib><creatorcontrib>SEO WON-GUK</creatorcontrib><creatorcontrib>KIM IN-BAE</creatorcontrib><creatorcontrib>LEE KI-BEOM</creatorcontrib><creatorcontrib>HAN SEUNG-YEON</creatorcontrib><creatorcontrib>PARK HONG SICK</creatorcontrib><creatorcontrib>JEONG JAE WOO</creatorcontrib><creatorcontrib>KIM SEON-II</creatorcontrib><creatorcontrib>CHO SAM-YOUNG</creatorcontrib><title>Metal wire etchant and method of forming metal wire using the same</title><description>A metal wire etchant including persulfate, a sulfonate, a fluorine compound, an azole-based compound, an organic acid, a nitrate, and a chlorine compound, and a method of making the same.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDyTS1JzFEozyxKVUgtSc5IzCtRSMxLUchNLcnIT1HIT1NIyy_KzcxLB4nAFJYWgwRKMlIVihNzU3kYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSXxosIWFhaWBsZGTkTERSgCcmTFK</recordid><startdate>20141118</startdate><enddate>20141118</enddate><creator>KIM GYU-PO</creator><creator>SHIN HYUNOL</creator><creator>CHOUNG JONG-HYUN</creator><creator>SEO WON-GUK</creator><creator>KIM IN-BAE</creator><creator>LEE KI-BEOM</creator><creator>HAN SEUNG-YEON</creator><creator>PARK HONG SICK</creator><creator>JEONG JAE WOO</creator><creator>KIM SEON-II</creator><creator>CHO SAM-YOUNG</creator><scope>EVB</scope></search><sort><creationdate>20141118</creationdate><title>Metal wire etchant and method of forming metal wire using the same</title><author>KIM GYU-PO ; SHIN HYUNOL ; CHOUNG JONG-HYUN ; SEO WON-GUK ; KIM IN-BAE ; LEE KI-BEOM ; HAN SEUNG-YEON ; PARK HONG SICK ; JEONG JAE WOO ; KIM SEON-II ; CHO SAM-YOUNG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8889032B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM GYU-PO</creatorcontrib><creatorcontrib>SHIN HYUNOL</creatorcontrib><creatorcontrib>CHOUNG JONG-HYUN</creatorcontrib><creatorcontrib>SEO WON-GUK</creatorcontrib><creatorcontrib>KIM IN-BAE</creatorcontrib><creatorcontrib>LEE KI-BEOM</creatorcontrib><creatorcontrib>HAN SEUNG-YEON</creatorcontrib><creatorcontrib>PARK HONG SICK</creatorcontrib><creatorcontrib>JEONG JAE WOO</creatorcontrib><creatorcontrib>KIM SEON-II</creatorcontrib><creatorcontrib>CHO SAM-YOUNG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM GYU-PO</au><au>SHIN HYUNOL</au><au>CHOUNG JONG-HYUN</au><au>SEO WON-GUK</au><au>KIM IN-BAE</au><au>LEE KI-BEOM</au><au>HAN SEUNG-YEON</au><au>PARK HONG SICK</au><au>JEONG JAE WOO</au><au>KIM SEON-II</au><au>CHO SAM-YOUNG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Metal wire etchant and method of forming metal wire using the same</title><date>2014-11-18</date><risdate>2014</risdate><abstract>A metal wire etchant including persulfate, a sulfonate, a fluorine compound, an azole-based compound, an organic acid, a nitrate, and a chlorine compound, and a method of making the same.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NATURAL RESINS NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PAINTS POLISHES SEMICONDUCTOR DEVICES |
| title | Metal wire etchant and method of forming metal wire using the same |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T16%3A35%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIM%20GYU-PO&rft.date=2014-11-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8889032B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |