Semiconductor device and method for low resistive thin film resistor interconnect

The invention relates to a semiconductor device and a method of manufacturing an electronic device. A first conductive layer (first metal interconnect layer) is deposited. There is an insulating layer (first intermetal dielectric) layer deposited. A resistive layer is deposited on top of the insulat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DIRNECKER CHRISTOPH ANDREAS OTHMAR, OLSEN LEIF CHRISTIAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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