Pair of substrate holders, substrate holder, substrate bonding apparatus and method for manufacturing device
A substrate holder pair comprising a first substrate holder and a second substrate holder that holds a first substrate and a second substrate bonded to each other, between itself and the first substrate holder. The first substrate holder includes a pressure receiving portion that, when the first sub...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MIIKE TAKAHIRO MORI HIROSHI YUKI DAISUKE |
| description | A substrate holder pair comprising a first substrate holder and a second substrate holder that holds a first substrate and a second substrate bonded to each other, between itself and the first substrate holder. The first substrate holder includes a pressure receiving portion that, when the first substrate holder is separated from the second substrate holder, is pressed by a pressing member, and the second substrate holder includes a passing portion through which passes the pressing member, to enable pressing of the pressure receiving portion by the pressing member. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8863808B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8863808B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8863808B23</originalsourceid><addsrcrecordid>eNqNyrEKwjAQgOEsDqK-wz2ABbEgmRWlo6DO5ZpcbCDNhVzi86vgILg4_fDxz1U4o8_ADqQOUjIWgpGDpSzrH_qWgaP18Q6YEr6gCmC0MFEZ2YLjDBPG6tCUmt-bpYc3tFQzh0Fo9elCwel4PXQNJe5JEhqKVPrbRetdqzd6v23_WJ7hqEIn</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Pair of substrate holders, substrate holder, substrate bonding apparatus and method for manufacturing device</title><source>esp@cenet</source><creator>MIIKE TAKAHIRO ; MORI HIROSHI ; YUKI DAISUKE</creator><creatorcontrib>MIIKE TAKAHIRO ; MORI HIROSHI ; YUKI DAISUKE</creatorcontrib><description>A substrate holder pair comprising a first substrate holder and a second substrate holder that holds a first substrate and a second substrate bonded to each other, between itself and the first substrate holder. The first substrate holder includes a pressure receiving portion that, when the first substrate holder is separated from the second substrate holder, is pressed by a pressing member, and the second substrate holder includes a passing portion through which passes the pressing member, to enable pressing of the pressure receiving portion by the pressing member.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TRANSPORTING</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141021&DB=EPODOC&CC=US&NR=8863808B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141021&DB=EPODOC&CC=US&NR=8863808B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIIKE TAKAHIRO</creatorcontrib><creatorcontrib>MORI HIROSHI</creatorcontrib><creatorcontrib>YUKI DAISUKE</creatorcontrib><title>Pair of substrate holders, substrate holder, substrate bonding apparatus and method for manufacturing device</title><description>A substrate holder pair comprising a first substrate holder and a second substrate holder that holds a first substrate and a second substrate bonded to each other, between itself and the first substrate holder. The first substrate holder includes a pressure receiving portion that, when the first substrate holder is separated from the second substrate holder, is pressed by a pressing member, and the second substrate holder includes a passing portion through which passes the pressing member, to enable pressing of the pressure receiving portion by the pressing member.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQgOEsDqK-wz2ABbEgmRWlo6DO5ZpcbCDNhVzi86vgILg4_fDxz1U4o8_ADqQOUjIWgpGDpSzrH_qWgaP18Q6YEr6gCmC0MFEZ2YLjDBPG6tCUmt-bpYc3tFQzh0Fo9elCwel4PXQNJe5JEhqKVPrbRetdqzd6v23_WJ7hqEIn</recordid><startdate>20141021</startdate><enddate>20141021</enddate><creator>MIIKE TAKAHIRO</creator><creator>MORI HIROSHI</creator><creator>YUKI DAISUKE</creator><scope>EVB</scope></search><sort><creationdate>20141021</creationdate><title>Pair of substrate holders, substrate holder, substrate bonding apparatus and method for manufacturing device</title><author>MIIKE TAKAHIRO ; MORI HIROSHI ; YUKI DAISUKE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8863808B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MIIKE TAKAHIRO</creatorcontrib><creatorcontrib>MORI HIROSHI</creatorcontrib><creatorcontrib>YUKI DAISUKE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIIKE TAKAHIRO</au><au>MORI HIROSHI</au><au>YUKI DAISUKE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Pair of substrate holders, substrate holder, substrate bonding apparatus and method for manufacturing device</title><date>2014-10-21</date><risdate>2014</risdate><abstract>A substrate holder pair comprising a first substrate holder and a second substrate holder that holds a first substrate and a second substrate bonded to each other, between itself and the first substrate holder. The first substrate holder includes a pressure receiving portion that, when the first substrate holder is separated from the second substrate holder, is pressed by a pressing member, and the second substrate holder includes a passing portion through which passes the pressing member, to enable pressing of the pressure receiving portion by the pressing member.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US8863808B2 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING |
| title | Pair of substrate holders, substrate holder, substrate bonding apparatus and method for manufacturing device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T00%3A12%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MIIKE%20TAKAHIRO&rft.date=2014-10-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8863808B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |