Software and method for via spacing in a semiconductor device

Software and method for via spacing in a semiconductor device

A computer-readable software product is provided for executing a method of determining the location of a plurality of power rail vias in a semiconductor device. The semiconductor device includes an active region and a power rail. Locations of a first via and a second via are assigned along the power...

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Hauptverfasser: TARRABIA MARC, DOMAN DAVID S, RASHED MAHBUB
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TARRABIA MARC
DOMAN DAVID S
RASHED MAHBUB
description A computer-readable software product is provided for executing a method of determining the location of a plurality of power rail vias in a semiconductor device. The semiconductor device includes an active region and a power rail. Locations of a first via and a second via are assigned along the power rail. The spacing between the location of the first via and the location of the second via is a minimum spacing allowable. The spacing between the location of the second via and the locations of structures in the active region which may electrically interfere with the second via is determined. The location of the second via is changed in response to the spacing between the location of the second via and the location of one of the structures in the active region being less than a predetermined distance.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Software and method for via spacing in a semiconductor device
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