Stress relief for plastic encapsulated devices

Stress relief for plastic encapsulated devices

A semiconductor integrated circuit includes a semiconductor substrate, one or more devices in or on the semiconductor substrate, and a dielectric layer above the one or more devices, wherein the dielectric layer has openings over at least portions of the one or more devices. The semiconductor integr...

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1. Verfasser: FRITZ SCOTT N
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description A semiconductor integrated circuit includes a semiconductor substrate, one or more devices in or on the semiconductor substrate, and a dielectric layer above the one or more devices, wherein the dielectric layer has openings over at least portions of the one or more devices. The semiconductor integrated circuit also includes plastic packaging material (e.g., plastic granules) on a top surface of the dielectric layer and over the openings. In some implementations, the one or more devices include bi-polar transistors, and the openings in the dielectric layer are located over base-emitter junctions of the bi-polar devices.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Stress relief for plastic encapsulated devices
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