Field transistor structure manufactured using gate last process

According to embodiments of the invention, a field transistor structure is provided. The field transistor structure includes a semiconductor substrate, a metal gate, a polycrystalline silicon (polysilicon) layer, and first and second metal portions. The polysilicon layer has first, second, third, an...

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Hauptverfasser: ITO AKIRA, LU CHAO-YANG, SHIAU GUANG-JYE
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creator ITO AKIRA
LU CHAO-YANG
SHIAU GUANG-JYE
description According to embodiments of the invention, a field transistor structure is provided. The field transistor structure includes a semiconductor substrate, a metal gate, a polycrystalline silicon (polysilicon) layer, and first and second metal portions. The polysilicon layer has first, second, third, and fourth sides and is disposed between the semiconductor substrate on the first side and the metal gate on the second side. The polysilicon layer is also disposed between the first and second metal portions on the third and fourth sides. According to some embodiments of the present invention, the field transistor structure may also include a thin metal layer disposed between the polysilicon layer and the semiconductor substrate. The thin metal layer may be electronically coupled to each of the first and second metal portions.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8841674B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8841674B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8841674B23</originalsourceid><addsrcrecordid>eNrjZLB3y0zNSVEoKUrMK84sLskvUiguKSpNLiktSlXITcwrTUsEs1MUSosz89IV0hNLUhVyEotLFAqK8pNTi4t5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakl8aLCFhYmhmbmJk5ExEUoAmGcxiw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Field transistor structure manufactured using gate last process</title><source>esp@cenet</source><creator>ITO AKIRA ; LU CHAO-YANG ; SHIAU GUANG-JYE</creator><creatorcontrib>ITO AKIRA ; LU CHAO-YANG ; SHIAU GUANG-JYE</creatorcontrib><description>According to embodiments of the invention, a field transistor structure is provided. The field transistor structure includes a semiconductor substrate, a metal gate, a polycrystalline silicon (polysilicon) layer, and first and second metal portions. The polysilicon layer has first, second, third, and fourth sides and is disposed between the semiconductor substrate on the first side and the metal gate on the second side. The polysilicon layer is also disposed between the first and second metal portions on the third and fourth sides. According to some embodiments of the present invention, the field transistor structure may also include a thin metal layer disposed between the polysilicon layer and the semiconductor substrate. The thin metal layer may be electronically coupled to each of the first and second metal portions.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140923&amp;DB=EPODOC&amp;CC=US&amp;NR=8841674B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140923&amp;DB=EPODOC&amp;CC=US&amp;NR=8841674B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ITO AKIRA</creatorcontrib><creatorcontrib>LU CHAO-YANG</creatorcontrib><creatorcontrib>SHIAU GUANG-JYE</creatorcontrib><title>Field transistor structure manufactured using gate last process</title><description>According to embodiments of the invention, a field transistor structure is provided. The field transistor structure includes a semiconductor substrate, a metal gate, a polycrystalline silicon (polysilicon) layer, and first and second metal portions. The polysilicon layer has first, second, third, and fourth sides and is disposed between the semiconductor substrate on the first side and the metal gate on the second side. The polysilicon layer is also disposed between the first and second metal portions on the third and fourth sides. According to some embodiments of the present invention, the field transistor structure may also include a thin metal layer disposed between the polysilicon layer and the semiconductor substrate. The thin metal layer may be electronically coupled to each of the first and second metal portions.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB3y0zNSVEoKUrMK84sLskvUiguKSpNLiktSlXITcwrTUsEs1MUSosz89IV0hNLUhVyEotLFAqK8pNTi4t5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakl8aLCFhYmhmbmJk5ExEUoAmGcxiw</recordid><startdate>20140923</startdate><enddate>20140923</enddate><creator>ITO AKIRA</creator><creator>LU CHAO-YANG</creator><creator>SHIAU GUANG-JYE</creator><scope>EVB</scope></search><sort><creationdate>20140923</creationdate><title>Field transistor structure manufactured using gate last process</title><author>ITO AKIRA ; LU CHAO-YANG ; SHIAU GUANG-JYE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8841674B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ITO AKIRA</creatorcontrib><creatorcontrib>LU CHAO-YANG</creatorcontrib><creatorcontrib>SHIAU GUANG-JYE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ITO AKIRA</au><au>LU CHAO-YANG</au><au>SHIAU GUANG-JYE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Field transistor structure manufactured using gate last process</title><date>2014-09-23</date><risdate>2014</risdate><abstract>According to embodiments of the invention, a field transistor structure is provided. The field transistor structure includes a semiconductor substrate, a metal gate, a polycrystalline silicon (polysilicon) layer, and first and second metal portions. The polysilicon layer has first, second, third, and fourth sides and is disposed between the semiconductor substrate on the first side and the metal gate on the second side. The polysilicon layer is also disposed between the first and second metal portions on the third and fourth sides. According to some embodiments of the present invention, the field transistor structure may also include a thin metal layer disposed between the polysilicon layer and the semiconductor substrate. The thin metal layer may be electronically coupled to each of the first and second metal portions.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Field transistor structure manufactured using gate last process
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T07%3A34%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ITO%20AKIRA&rft.date=2014-09-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8841674B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true