Slotted configuration for optimized placement of micro-components using adhesive bonding

An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and "shape" of an adhesive "dot&q...

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Bibliographische Detailangaben

Hauptverfasser:	PATEL VIPULKUMAR, WEBSTER MARK, GOTHOSKAR PRAKASH, FANGMAN JOHN, FANGMAN JOHN MATTHEW, NADEAU MARY
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES
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