Semiconductor wafer carrier
A system and a method for protecting semiconductor wafers is disclosed. A preferred embodiment comprises a carrier with a central region and an exterior region. The exterior region preferably has a thickness that is greater than the central region, to form a cavity in the carrier. An adhesive is pre...
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| creator | CHEN MING-FA HUANG JAO SHENG |
| description | A system and a method for protecting semiconductor wafers is disclosed. A preferred embodiment comprises a carrier with a central region and an exterior region. The exterior region preferably has a thickness that is greater than the central region, to form a cavity in the carrier. An adhesive is preferably placed into the cavity, and a semiconductor wafer is placed onto the adhesive. The edges of the semiconductor wafer are protected by the raised exterior region as well as the displaced adhesive that at least partially fills the area between the semiconductor wafer and the exterior region of the carrier. |
| format | Patent |
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The exterior region preferably has a thickness that is greater than the central region, to form a cavity in the carrier. An adhesive is preferably placed into the cavity, and a semiconductor wafer is placed onto the adhesive. The edges of the semiconductor wafer are protected by the raised exterior region as well as the displaced adhesive that at least partially fills the area between the semiconductor wafer and the exterior region of the carrier.</description><language>eng</language><subject>COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT ; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ; MACHINE TOOLS ; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; TRANSPORTING</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140902&DB=EPODOC&CC=US&NR=8820728B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140902&DB=EPODOC&CC=US&NR=8820728B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN MING-FA</creatorcontrib><creatorcontrib>HUANG JAO SHENG</creatorcontrib><title>Semiconductor wafer carrier</title><description>A system and a method for protecting semiconductor wafers is disclosed. A preferred embodiment comprises a carrier with a central region and an exterior region. The exterior region preferably has a thickness that is greater than the central region, to form a cavity in the carrier. An adhesive is preferably placed into the cavity, and a semiconductor wafer is placed onto the adhesive. The edges of the semiconductor wafer are protected by the raised exterior region as well as the displaced adhesive that at least partially fills the area between the semiconductor wafer and the exterior region of the carrier.</description><subject>COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT</subject><subject>DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING</subject><subject>MACHINE TOOLS</subject><subject>MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAOTs3NTM7PSylNLskvUihPTEstUkhOLCrKTC3iYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocEWFkYG5kYWTkbGRCgBAFHJI3Y</recordid><startdate>20140902</startdate><enddate>20140902</enddate><creator>CHEN MING-FA</creator><creator>HUANG JAO SHENG</creator><scope>EVB</scope></search><sort><creationdate>20140902</creationdate><title>Semiconductor wafer carrier</title><author>CHEN MING-FA ; HUANG JAO SHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8820728B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT</topic><topic>DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING</topic><topic>MACHINE TOOLS</topic><topic>MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN MING-FA</creatorcontrib><creatorcontrib>HUANG JAO SHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN MING-FA</au><au>HUANG JAO SHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor wafer carrier</title><date>2014-09-02</date><risdate>2014</risdate><abstract>A system and a method for protecting semiconductor wafers is disclosed. A preferred embodiment comprises a carrier with a central region and an exterior region. The exterior region preferably has a thickness that is greater than the central region, to form a cavity in the carrier. An adhesive is preferably placed into the cavity, and a semiconductor wafer is placed onto the adhesive. The edges of the semiconductor wafer are protected by the raised exterior region as well as the displaced adhesive that at least partially fills the area between the semiconductor wafer and the exterior region of the carrier.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS TRANSPORTING |
| title | Semiconductor wafer carrier |
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