Panelized process for SMT sensor devices

Panelized process for SMT sensor devices

A method is presented for forming multiple surface mount technology (SMT) sensor packages in a panel for separation into individual SMT sensor packages. A base plate is mapped as a grid of sensor footprints, and each footprint is populated with electronic and sensor components. A cover plate includi...

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1. Verfasser: BARLOW ARTHUR
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator BARLOW ARTHUR
description A method is presented for forming multiple surface mount technology (SMT) sensor packages in a panel for separation into individual SMT sensor packages. A base plate is mapped as a grid of sensor footprints, and each footprint is populated with electronic and sensor components. A cover plate including window elements is mapped to a similar grid. The cover plate is bonded to the base plate, such that the window elements are positioned to allow incident electromagnetic radiation upon corresponding sensors mounted on the printed circuit board. Each sensor footprint is sealed within a recess or cell beneath the cover. The sensor circuits may be tested before and/or after being separated into individual SMT sensor packages.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Panelized process for SMT sensor devices
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