Inline defect analysis for sampling and SPC
In one embodiment, an inline defect analysis method includes receiving geometric characteristics of individual defects and design data corresponding to the individual defects, determining which of the individual defects are likely to be nuisance defects using the geometric characteristics and the co...
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creator | JAWAHARLAL SUNDAR SVIDENKO VICKY SCHWARM ALEXANDER T SHIMSHI RINAT NEHMADI YOUVAL |
description | In one embodiment, an inline defect analysis method includes receiving geometric characteristics of individual defects and design data corresponding to the individual defects, determining which of the individual defects are likely to be nuisance defects using the geometric characteristics and the corresponding design data, and refraining from sampling the defects that are likely to be nuisance defects. |
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COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140805&DB=EPODOC&CC=US&NR=8799831B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140805&DB=EPODOC&CC=US&NR=8799831B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JAWAHARLAL SUNDAR</creatorcontrib><creatorcontrib>SVIDENKO VICKY</creatorcontrib><creatorcontrib>SCHWARM ALEXANDER T</creatorcontrib><creatorcontrib>SHIMSHI RINAT</creatorcontrib><creatorcontrib>NEHMADI YOUVAL</creatorcontrib><title>Inline defect analysis for sampling and SPC</title><description>In one embodiment, an inline defect analysis method includes receiving geometric characteristics of individual defects and design data corresponding to the individual defects, determining which of the individual defects are likely to be nuisance defects using the geometric characteristics and the corresponding design data, and refraining from sampling the defects that are likely to be nuisance defects.</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND2zMvJzEtVSElNS00uUUjMS8ypLM4sVkjLL1IoTswtAEqmA0VTFIIDnHkYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSXxosIW5paWFsaGTkTERSgDcmCin</recordid><startdate>20140805</startdate><enddate>20140805</enddate><creator>JAWAHARLAL SUNDAR</creator><creator>SVIDENKO VICKY</creator><creator>SCHWARM ALEXANDER T</creator><creator>SHIMSHI RINAT</creator><creator>NEHMADI YOUVAL</creator><scope>EVB</scope></search><sort><creationdate>20140805</creationdate><title>Inline defect analysis for sampling and SPC</title><author>JAWAHARLAL SUNDAR ; SVIDENKO VICKY ; SCHWARM ALEXANDER T ; SHIMSHI RINAT ; NEHMADI YOUVAL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8799831B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>JAWAHARLAL SUNDAR</creatorcontrib><creatorcontrib>SVIDENKO VICKY</creatorcontrib><creatorcontrib>SCHWARM ALEXANDER T</creatorcontrib><creatorcontrib>SHIMSHI RINAT</creatorcontrib><creatorcontrib>NEHMADI YOUVAL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JAWAHARLAL SUNDAR</au><au>SVIDENKO VICKY</au><au>SCHWARM ALEXANDER T</au><au>SHIMSHI RINAT</au><au>NEHMADI YOUVAL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Inline defect analysis for sampling and SPC</title><date>2014-08-05</date><risdate>2014</risdate><abstract>In one embodiment, an inline defect analysis method includes receiving geometric characteristics of individual defects and design data corresponding to the individual defects, determining which of the individual defects are likely to be nuisance defects using the geometric characteristics and the corresponding design data, and refraining from sampling the defects that are likely to be nuisance defects.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING |
title | Inline defect analysis for sampling and SPC |
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