Underfill adhesion measurements at a microscopic scale

Methods and systems to method to determine an adhesion force of an underfill material to a chip assembled in a flip-chip module are provided. A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PAQUET MARIE-CLAUDE, SYLVESTRE JULIEN, CADOTTE MAXIME
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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