Multi-layered chemical-mechanical planarization pad

The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATHEW ANOOP, QIAO SCOTT XIN, HSU OSCAR K, LEFEVRE PAUL, WELLS DAVID ADAM, WU GUANGWEI, JIN MARC C, ALDEBORGH JOHN ERIK
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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