Method of grooving a chemical-mechanical planarization pad

Method of grooving a chemical-mechanical planarization pad

A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MATHEW ANOOP, HSU OSCAR K, LEFEVRE PAUL, WELLS DAVID ADAM, WU GUANGWEI, JIN MARC C, ALDEBORGH JOHN ERIK
Format: Patent
Sprache:eng
Schlagworte:
GRINDING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Beschreibung
Zusammenfassung:A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1) (X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.