One component epoxy resin composition
The present invention relates to heat-curable compositions containing a mixture of reactive epoxy resins that contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | WALTER PABLO SCHOENFELD RAINER TROLL ANGELIKA BENOMAR MUSTAPHA KREILING STEFAN |
| description | The present invention relates to heat-curable compositions containing a mixture of reactive epoxy resins that contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and at least one latent hardener. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8758549B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8758549B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8758549B23</originalsourceid><addsrcrecordid>eNrjZFD1z0tVSM7PLcjPS80rUUgtyK-oVChKLc7Mg4gWZ5Zk5ufxMLCmJeYUp_JCaW4GBTfXEGcPXaD6-NTigsTk1LzUkvjQYAtzUwtTE0snI2MilAAAIDoneQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>One component epoxy resin composition</title><source>esp@cenet</source><creator>WALTER PABLO ; SCHOENFELD RAINER ; TROLL ANGELIKA ; BENOMAR MUSTAPHA ; KREILING STEFAN</creator><creatorcontrib>WALTER PABLO ; SCHOENFELD RAINER ; TROLL ANGELIKA ; BENOMAR MUSTAPHA ; KREILING STEFAN</creatorcontrib><description>The present invention relates to heat-curable compositions containing a mixture of reactive epoxy resins that contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and at least one latent hardener.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140624&DB=EPODOC&CC=US&NR=8758549B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140624&DB=EPODOC&CC=US&NR=8758549B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WALTER PABLO</creatorcontrib><creatorcontrib>SCHOENFELD RAINER</creatorcontrib><creatorcontrib>TROLL ANGELIKA</creatorcontrib><creatorcontrib>BENOMAR MUSTAPHA</creatorcontrib><creatorcontrib>KREILING STEFAN</creatorcontrib><title>One component epoxy resin composition</title><description>The present invention relates to heat-curable compositions containing a mixture of reactive epoxy resins that contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and at least one latent hardener.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD1z0tVSM7PLcjPS80rUUgtyK-oVChKLc7Mg4gWZ5Zk5ufxMLCmJeYUp_JCaW4GBTfXEGcPXaD6-NTigsTk1LzUkvjQYAtzUwtTE0snI2MilAAAIDoneQ</recordid><startdate>20140624</startdate><enddate>20140624</enddate><creator>WALTER PABLO</creator><creator>SCHOENFELD RAINER</creator><creator>TROLL ANGELIKA</creator><creator>BENOMAR MUSTAPHA</creator><creator>KREILING STEFAN</creator><scope>EVB</scope></search><sort><creationdate>20140624</creationdate><title>One component epoxy resin composition</title><author>WALTER PABLO ; SCHOENFELD RAINER ; TROLL ANGELIKA ; BENOMAR MUSTAPHA ; KREILING STEFAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8758549B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>WALTER PABLO</creatorcontrib><creatorcontrib>SCHOENFELD RAINER</creatorcontrib><creatorcontrib>TROLL ANGELIKA</creatorcontrib><creatorcontrib>BENOMAR MUSTAPHA</creatorcontrib><creatorcontrib>KREILING STEFAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WALTER PABLO</au><au>SCHOENFELD RAINER</au><au>TROLL ANGELIKA</au><au>BENOMAR MUSTAPHA</au><au>KREILING STEFAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>One component epoxy resin composition</title><date>2014-06-24</date><risdate>2014</risdate><abstract>The present invention relates to heat-curable compositions containing a mixture of reactive epoxy resins that contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and at least one latent hardener.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US8758549B2 |
| source | esp@cenet |
| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | One component epoxy resin composition |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-13T07%3A19%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WALTER%20PABLO&rft.date=2014-06-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8758549B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |