Vertical electrical interconnect formed on support prior to die mount

A die assembly includes a die mounted to a support, in which the support has interconnect pedestals formed at bond pads, and the die has interconnect terminals projecting beyond a die edge into corresponding pedestals. Also, a support has interconnect pedestals. Also, a method for electrically inter...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MCELREA SIMON J. S, DU YONG, CASKEY TERRENCE, SCOTT MARK, ANDREWS, JR. LAWRENCE DOUGLAS, MCGRATH SCOTT
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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