Semiconductor die micro electro-mechanical switch management system and method

A die micro electro-mechanical switch management system and method facilitate power conservation by selectively preventing electrical current from flowing in designated components. A present invention semiconductor die comprises a block of transistors for performing switching operations, a bus (e.g....

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1. Verfasser: DIAMOND MICHAEL B
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creator DIAMOND MICHAEL B
description A die micro electro-mechanical switch management system and method facilitate power conservation by selectively preventing electrical current from flowing in designated components. A present invention semiconductor die comprises a block of transistors for performing switching operations, a bus (e.g., a power bus, a signal bus, etc.) for conveying electrical current and a micro electro-mechanical switch that couples and decouples the block of transistors to and from the bus. The micro electro-mechanical switch is opened and closed depending upon operations (e.g., switching operations) being performed by the block of transistors. Electrical current is prevented from flowing to the block of transistors when the micro electro-mechanical switch is open and the block of transistors is electrically isolated. The micro electro-mechanical switch can interrupt electrical current flow in a plurality of the bus lines and/or can be included in a relay array.
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A present invention semiconductor die comprises a block of transistors for performing switching operations, a bus (e.g., a power bus, a signal bus, etc.) for conveying electrical current and a micro electro-mechanical switch that couples and decouples the block of transistors to and from the bus. The micro electro-mechanical switch is opened and closed depending upon operations (e.g., switching operations) being performed by the block of transistors. Electrical current is prevented from flowing to the block of transistors when the micro electro-mechanical switch is open and the block of transistors is electrically isolated. The micro electro-mechanical switch can interrupt electrical current flow in a plurality of the bus lines and/or can be included in a relay array.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. 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A present invention semiconductor die comprises a block of transistors for performing switching operations, a bus (e.g., a power bus, a signal bus, etc.) for conveying electrical current and a micro electro-mechanical switch that couples and decouples the block of transistors to and from the bus. The micro electro-mechanical switch is opened and closed depending upon operations (e.g., switching operations) being performed by the block of transistors. Electrical current is prevented from flowing to the block of transistors when the micro electro-mechanical switch is open and the block of transistors is electrically isolated. The micro electro-mechanical switch can interrupt electrical current flow in a plurality of the bus lines and/or can be included in a relay array.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. 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subjects BASIC ELECTRIC ELEMENTS
CALCULATING
CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION ANDCOMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THIR OWNENERGY USE
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC SWITCHES
ELECTRICITY
EMERGENCY PROTECTIVE DEVICES
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
PHYSICS
RELAYS
SELECTORS
SEMICONDUCTOR DEVICES
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
title Semiconductor die micro electro-mechanical switch management system and method
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