Electronic device, assembling method of electronic module and disassembling method of electronic module

An electronic device is provided, which includes a bottom casing, an electronic module, at least a positioning part and an upper cover. The electronic module is disposed in the bottom casing. The positioning part is connected to the electronic module. The upper cover includes a cover body and a posi...

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Hauptverfasser: CHEN HUNGI, LAI CHUNG-KUO, LIU MINGI, TSAO CHIA-TE
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Sprache:eng
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creator CHEN HUNGI
LAI CHUNG-KUO
LIU MINGI
TSAO CHIA-TE
description An electronic device is provided, which includes a bottom casing, an electronic module, at least a positioning part and an upper cover. The electronic module is disposed in the bottom casing. The positioning part is connected to the electronic module. The upper cover includes a cover body and a positioning portion. The cover body is assembled to the bottom casing. The positioning portion is connected to the cover body. A structural interference between the positioning portion and the positioning part makes the electronic module positioned. In addition, an assembling method of electronic module and a disassembling method of electronic module are also provided.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8699219B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8699219B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8699219B23</originalsourceid><addsrcrecordid>eNrjZEh3zUlNLinKz8tMVkhJLctMTtVRSCwuTs1NysnMS1fITS3JyE9RyE9TSEWoy81PKc1JVUjMS1FIySwmTjUPA2taYk5xKi-U5mZQcHMNcfbQTS3Ij08tLkhMTs1LLYkPDbYws7Q0MrR0MjImQgkAYcFAIQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic device, assembling method of electronic module and disassembling method of electronic module</title><source>esp@cenet</source><creator>CHEN HUNGI ; LAI CHUNG-KUO ; LIU MINGI ; TSAO CHIA-TE</creator><creatorcontrib>CHEN HUNGI ; LAI CHUNG-KUO ; LIU MINGI ; TSAO CHIA-TE</creatorcontrib><description>An electronic device is provided, which includes a bottom casing, an electronic module, at least a positioning part and an upper cover. The electronic module is disposed in the bottom casing. The positioning part is connected to the electronic module. The upper cover includes a cover body and a positioning portion. The cover body is assembled to the bottom casing. The positioning portion is connected to the cover body. A structural interference between the positioning portion and the positioning part makes the electronic module positioned. In addition, an assembling method of electronic module and a disassembling method of electronic module are also provided.</description><language>eng</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140415&amp;DB=EPODOC&amp;CC=US&amp;NR=8699219B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140415&amp;DB=EPODOC&amp;CC=US&amp;NR=8699219B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN HUNGI</creatorcontrib><creatorcontrib>LAI CHUNG-KUO</creatorcontrib><creatorcontrib>LIU MINGI</creatorcontrib><creatorcontrib>TSAO CHIA-TE</creatorcontrib><title>Electronic device, assembling method of electronic module and disassembling method of electronic module</title><description>An electronic device is provided, which includes a bottom casing, an electronic module, at least a positioning part and an upper cover. The electronic module is disposed in the bottom casing. The positioning part is connected to the electronic module. The upper cover includes a cover body and a positioning portion. The cover body is assembled to the bottom casing. The positioning portion is connected to the cover body. A structural interference between the positioning portion and the positioning part makes the electronic module positioned. In addition, an assembling method of electronic module and a disassembling method of electronic module are also provided.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEh3zUlNLinKz8tMVkhJLctMTtVRSCwuTs1NysnMS1fITS3JyE9RyE9TSEWoy81PKc1JVUjMS1FIySwmTjUPA2taYk5xKi-U5mZQcHMNcfbQTS3Ij08tLkhMTs1LLYkPDbYws7Q0MrR0MjImQgkAYcFAIQ</recordid><startdate>20140415</startdate><enddate>20140415</enddate><creator>CHEN HUNGI</creator><creator>LAI CHUNG-KUO</creator><creator>LIU MINGI</creator><creator>TSAO CHIA-TE</creator><scope>EVB</scope></search><sort><creationdate>20140415</creationdate><title>Electronic device, assembling method of electronic module and disassembling method of electronic module</title><author>CHEN HUNGI ; LAI CHUNG-KUO ; LIU MINGI ; TSAO CHIA-TE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8699219B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN HUNGI</creatorcontrib><creatorcontrib>LAI CHUNG-KUO</creatorcontrib><creatorcontrib>LIU MINGI</creatorcontrib><creatorcontrib>TSAO CHIA-TE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN HUNGI</au><au>LAI CHUNG-KUO</au><au>LIU MINGI</au><au>TSAO CHIA-TE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic device, assembling method of electronic module and disassembling method of electronic module</title><date>2014-04-15</date><risdate>2014</risdate><abstract>An electronic device is provided, which includes a bottom casing, an electronic module, at least a positioning part and an upper cover. The electronic module is disposed in the bottom casing. The positioning part is connected to the electronic module. The upper cover includes a cover body and a positioning portion. The cover body is assembled to the bottom casing. The positioning portion is connected to the cover body. A structural interference between the positioning portion and the positioning part makes the electronic module positioned. In addition, an assembling method of electronic module and a disassembling method of electronic module are also provided.</abstract><oa>free_for_read</oa></addata></record>
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subjects CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
title Electronic device, assembling method of electronic module and disassembling method of electronic module
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T13%3A41%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHEN%20HUNGI&rft.date=2014-04-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8699219B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true