Backlight unit comprising a bottom cover including an embossing portion that overlaps with a portion of an LED package and liquid crystal display using the same

Backlight unit comprising a bottom cover including an embossing portion that overlaps with a portion of an LED package and liquid crystal display using the same

A backlight unit comprises a light emitting diode (LED) package including one or more LED chips, a light source PCB mounting one side of a bottom of the LED package or both sides of the bottom of the LED package, a bottom cover supporting the light source PCB under the light source PCB, and having a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE JOOHONG, OH SEOKHWAN
Format: Patent
Sprache:eng
Schlagworte:
ADVERTISING
BLASTING
CRYPTOGRAPHY
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
DISPLAY
DISPLAYING
EDUCATION
FREQUENCY-CHANGING
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF
HEATING
LABELS OR NAME-PLATES
LIGHTING
MECHANICAL ENGINEERING
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
SEALS
SIGNS
STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
WEAPONS
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Beschreibung
Zusammenfassung:A backlight unit comprises a light emitting diode (LED) package including one or more LED chips, a light source PCB mounting one side of a bottom of the LED package or both sides of the bottom of the LED package, a bottom cover supporting the light source PCB under the light source PCB, and having an embossing portion which protrudes toward the LED package with a size corresponding to the bottom of the LED package which is not mounted on the light source PCB, and a heat emission material filling between the bottom of the LED package and the embossing portion.