Process for producing modified epoxy resin

An epoxy resin composition comprises an epoxy resin (A) and rubber-like polymer particles (B). The rubber-like polymer particles (B) maintain a finely dispersed state of primary particles. The content of the rubber-like polymer particles (B) is 0.5 to 80% by weight when the total amount of the epoxy...

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Hauptverfasser: UENO MASAKUNI, YAMAGUCHI KATSUMI, MIYAMOTO MASAHIRO
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creator UENO MASAKUNI
YAMAGUCHI KATSUMI
MIYAMOTO MASAHIRO
description An epoxy resin composition comprises an epoxy resin (A) and rubber-like polymer particles (B). The rubber-like polymer particles (B) maintain a finely dispersed state of primary particles. The content of the rubber-like polymer particles (B) is 0.5 to 80% by weight when the total amount of the epoxy resin (A) and rubber-like polymer particles (B) is 100% by weight. Rubber-like polymer particles (B) are obtainable by graft-polymerizing 5 to 50% by weight of a shell layer (B-2) with 50 to 95% by weight of a rubber particle core (B-1), and average particle diameter of the rubber-like polymer particles (B) is 0.03 to 2 μm. Rubber particle core (B-1) comprises elastic material of not less than 50% by weight of at least one monomer selected from diene monomers and (meth)acrylate monomers and less than 50% by weight of another coploymerizable vinyl monomer, or polysiloxane rubber elastic materials, or a mixture thereof.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8680180B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8680180B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8680180B23</originalsourceid><addsrcrecordid>eNrjZNAKKMpPTi0uVkjLL1IoKMpPKU3OzEtXyM1PyUzLTE1RSC3Ir6hUKEotzszjYWBNS8wpTuWF0twMCm6uIc4eukA18anFBYnJqXmpJfGhwRZmFgaGFgZORsZEKAEA_NUpCQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Process for producing modified epoxy resin</title><source>esp@cenet</source><creator>UENO MASAKUNI ; YAMAGUCHI KATSUMI ; MIYAMOTO MASAHIRO</creator><creatorcontrib>UENO MASAKUNI ; YAMAGUCHI KATSUMI ; MIYAMOTO MASAHIRO</creatorcontrib><description>An epoxy resin composition comprises an epoxy resin (A) and rubber-like polymer particles (B). The rubber-like polymer particles (B) maintain a finely dispersed state of primary particles. The content of the rubber-like polymer particles (B) is 0.5 to 80% by weight when the total amount of the epoxy resin (A) and rubber-like polymer particles (B) is 100% by weight. Rubber-like polymer particles (B) are obtainable by graft-polymerizing 5 to 50% by weight of a shell layer (B-2) with 50 to 95% by weight of a rubber particle core (B-1), and average particle diameter of the rubber-like polymer particles (B) is 0.03 to 2 μm. Rubber particle core (B-1) comprises elastic material of not less than 50% by weight of at least one monomer selected from diene monomers and (meth)acrylate monomers and less than 50% by weight of another coploymerizable vinyl monomer, or polysiloxane rubber elastic materials, or a mixture thereof.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140325&amp;DB=EPODOC&amp;CC=US&amp;NR=8680180B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140325&amp;DB=EPODOC&amp;CC=US&amp;NR=8680180B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UENO MASAKUNI</creatorcontrib><creatorcontrib>YAMAGUCHI KATSUMI</creatorcontrib><creatorcontrib>MIYAMOTO MASAHIRO</creatorcontrib><title>Process for producing modified epoxy resin</title><description>An epoxy resin composition comprises an epoxy resin (A) and rubber-like polymer particles (B). The rubber-like polymer particles (B) maintain a finely dispersed state of primary particles. The content of the rubber-like polymer particles (B) is 0.5 to 80% by weight when the total amount of the epoxy resin (A) and rubber-like polymer particles (B) is 100% by weight. Rubber-like polymer particles (B) are obtainable by graft-polymerizing 5 to 50% by weight of a shell layer (B-2) with 50 to 95% by weight of a rubber particle core (B-1), and average particle diameter of the rubber-like polymer particles (B) is 0.03 to 2 μm. Rubber particle core (B-1) comprises elastic material of not less than 50% by weight of at least one monomer selected from diene monomers and (meth)acrylate monomers and less than 50% by weight of another coploymerizable vinyl monomer, or polysiloxane rubber elastic materials, or a mixture thereof.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAKKMpPTi0uVkjLL1IoKMpPKU3OzEtXyM1PyUzLTE1RSC3Ir6hUKEotzszjYWBNS8wpTuWF0twMCm6uIc4eukA18anFBYnJqXmpJfGhwRZmFgaGFgZORsZEKAEA_NUpCQ</recordid><startdate>20140325</startdate><enddate>20140325</enddate><creator>UENO MASAKUNI</creator><creator>YAMAGUCHI KATSUMI</creator><creator>MIYAMOTO MASAHIRO</creator><scope>EVB</scope></search><sort><creationdate>20140325</creationdate><title>Process for producing modified epoxy resin</title><author>UENO MASAKUNI ; YAMAGUCHI KATSUMI ; MIYAMOTO MASAHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8680180B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>UENO MASAKUNI</creatorcontrib><creatorcontrib>YAMAGUCHI KATSUMI</creatorcontrib><creatorcontrib>MIYAMOTO MASAHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UENO MASAKUNI</au><au>YAMAGUCHI KATSUMI</au><au>MIYAMOTO MASAHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Process for producing modified epoxy resin</title><date>2014-03-25</date><risdate>2014</risdate><abstract>An epoxy resin composition comprises an epoxy resin (A) and rubber-like polymer particles (B). The rubber-like polymer particles (B) maintain a finely dispersed state of primary particles. The content of the rubber-like polymer particles (B) is 0.5 to 80% by weight when the total amount of the epoxy resin (A) and rubber-like polymer particles (B) is 100% by weight. Rubber-like polymer particles (B) are obtainable by graft-polymerizing 5 to 50% by weight of a shell layer (B-2) with 50 to 95% by weight of a rubber particle core (B-1), and average particle diameter of the rubber-like polymer particles (B) is 0.03 to 2 μm. Rubber particle core (B-1) comprises elastic material of not less than 50% by weight of at least one monomer selected from diene monomers and (meth)acrylate monomers and less than 50% by weight of another coploymerizable vinyl monomer, or polysiloxane rubber elastic materials, or a mixture thereof.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
title Process for producing modified epoxy resin
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T11%3A01%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=UENO%20MASAKUNI&rft.date=2014-03-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8680180B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true