Process for producing modified epoxy resin
An epoxy resin composition comprises an epoxy resin (A) and rubber-like polymer particles (B). The rubber-like polymer particles (B) maintain a finely dispersed state of primary particles. The content of the rubber-like polymer particles (B) is 0.5 to 80% by weight when the total amount of the epoxy...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | UENO MASAKUNI YAMAGUCHI KATSUMI MIYAMOTO MASAHIRO |
description | An epoxy resin composition comprises an epoxy resin (A) and rubber-like polymer particles (B). The rubber-like polymer particles (B) maintain a finely dispersed state of primary particles. The content of the rubber-like polymer particles (B) is 0.5 to 80% by weight when the total amount of the epoxy resin (A) and rubber-like polymer particles (B) is 100% by weight. Rubber-like polymer particles (B) are obtainable by graft-polymerizing 5 to 50% by weight of a shell layer (B-2) with 50 to 95% by weight of a rubber particle core (B-1), and average particle diameter of the rubber-like polymer particles (B) is 0.03 to 2 μm. Rubber particle core (B-1) comprises elastic material of not less than 50% by weight of at least one monomer selected from diene monomers and (meth)acrylate monomers and less than 50% by weight of another coploymerizable vinyl monomer, or polysiloxane rubber elastic materials, or a mixture thereof. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8680180B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8680180B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8680180B23</originalsourceid><addsrcrecordid>eNrjZNAKKMpPTi0uVkjLL1IoKMpPKU3OzEtXyM1PyUzLTE1RSC3Ir6hUKEotzszjYWBNS8wpTuWF0twMCm6uIc4eukA18anFBYnJqXmpJfGhwRZmFgaGFgZORsZEKAEA_NUpCQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Process for producing modified epoxy resin</title><source>esp@cenet</source><creator>UENO MASAKUNI ; YAMAGUCHI KATSUMI ; MIYAMOTO MASAHIRO</creator><creatorcontrib>UENO MASAKUNI ; YAMAGUCHI KATSUMI ; MIYAMOTO MASAHIRO</creatorcontrib><description>An epoxy resin composition comprises an epoxy resin (A) and rubber-like polymer particles (B). The rubber-like polymer particles (B) maintain a finely dispersed state of primary particles. The content of the rubber-like polymer particles (B) is 0.5 to 80% by weight when the total amount of the epoxy resin (A) and rubber-like polymer particles (B) is 100% by weight. Rubber-like polymer particles (B) are obtainable by graft-polymerizing 5 to 50% by weight of a shell layer (B-2) with 50 to 95% by weight of a rubber particle core (B-1), and average particle diameter of the rubber-like polymer particles (B) is 0.03 to 2 μm. Rubber particle core (B-1) comprises elastic material of not less than 50% by weight of at least one monomer selected from diene monomers and (meth)acrylate monomers and less than 50% by weight of another coploymerizable vinyl monomer, or polysiloxane rubber elastic materials, or a mixture thereof.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140325&DB=EPODOC&CC=US&NR=8680180B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140325&DB=EPODOC&CC=US&NR=8680180B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UENO MASAKUNI</creatorcontrib><creatorcontrib>YAMAGUCHI KATSUMI</creatorcontrib><creatorcontrib>MIYAMOTO MASAHIRO</creatorcontrib><title>Process for producing modified epoxy resin</title><description>An epoxy resin composition comprises an epoxy resin (A) and rubber-like polymer particles (B). The rubber-like polymer particles (B) maintain a finely dispersed state of primary particles. The content of the rubber-like polymer particles (B) is 0.5 to 80% by weight when the total amount of the epoxy resin (A) and rubber-like polymer particles (B) is 100% by weight. Rubber-like polymer particles (B) are obtainable by graft-polymerizing 5 to 50% by weight of a shell layer (B-2) with 50 to 95% by weight of a rubber particle core (B-1), and average particle diameter of the rubber-like polymer particles (B) is 0.03 to 2 μm. Rubber particle core (B-1) comprises elastic material of not less than 50% by weight of at least one monomer selected from diene monomers and (meth)acrylate monomers and less than 50% by weight of another coploymerizable vinyl monomer, or polysiloxane rubber elastic materials, or a mixture thereof.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAKKMpPTi0uVkjLL1IoKMpPKU3OzEtXyM1PyUzLTE1RSC3Ir6hUKEotzszjYWBNS8wpTuWF0twMCm6uIc4eukA18anFBYnJqXmpJfGhwRZmFgaGFgZORsZEKAEA_NUpCQ</recordid><startdate>20140325</startdate><enddate>20140325</enddate><creator>UENO MASAKUNI</creator><creator>YAMAGUCHI KATSUMI</creator><creator>MIYAMOTO MASAHIRO</creator><scope>EVB</scope></search><sort><creationdate>20140325</creationdate><title>Process for producing modified epoxy resin</title><author>UENO MASAKUNI ; YAMAGUCHI KATSUMI ; MIYAMOTO MASAHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8680180B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>UENO MASAKUNI</creatorcontrib><creatorcontrib>YAMAGUCHI KATSUMI</creatorcontrib><creatorcontrib>MIYAMOTO MASAHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UENO MASAKUNI</au><au>YAMAGUCHI KATSUMI</au><au>MIYAMOTO MASAHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Process for producing modified epoxy resin</title><date>2014-03-25</date><risdate>2014</risdate><abstract>An epoxy resin composition comprises an epoxy resin (A) and rubber-like polymer particles (B). The rubber-like polymer particles (B) maintain a finely dispersed state of primary particles. The content of the rubber-like polymer particles (B) is 0.5 to 80% by weight when the total amount of the epoxy resin (A) and rubber-like polymer particles (B) is 100% by weight. Rubber-like polymer particles (B) are obtainable by graft-polymerizing 5 to 50% by weight of a shell layer (B-2) with 50 to 95% by weight of a rubber particle core (B-1), and average particle diameter of the rubber-like polymer particles (B) is 0.03 to 2 μm. Rubber particle core (B-1) comprises elastic material of not less than 50% by weight of at least one monomer selected from diene monomers and (meth)acrylate monomers and less than 50% by weight of another coploymerizable vinyl monomer, or polysiloxane rubber elastic materials, or a mixture thereof.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US8680180B2 |
source | esp@cenet |
subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP |
title | Process for producing modified epoxy resin |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T11%3A01%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=UENO%20MASAKUNI&rft.date=2014-03-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8680180B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |