Method for packing solid organometallic compound and packed container
A method for packing a solid organometallic compound into a container for packing the compound is provided, wherein the solid organometallic compound can be stably supplied to a vapor phase epitaxial growth apparatus such as an MOCVD apparatus at a constant concentration for a long period of time. I...
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creator | HAGA KENICHI TOKUDOME KOHICHI TOMIYASU SHIZUO |
description | A method for packing a solid organometallic compound into a container for packing the compound is provided, wherein the solid organometallic compound can be stably supplied to a vapor phase epitaxial growth apparatus such as an MOCVD apparatus at a constant concentration for a long period of time. In the method for packing a solid organometallic compound into a container for packing, the compound is composed of grains having a grain size of 8 mm or less and the grains of the compound essentially comprise grains having a grain size of 2.5 to 6 mm. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8673413B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8673413B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8673413B23</originalsourceid><addsrcrecordid>eNrjZHD1TS3JyE9RSMsvUihITM7OzEtXKM7PyUxRyC9KT8zLz00tSczJyUxWSM7PLcgvzUtRSARikMrUFKBYXkliZl5qEQ8Da1piTnEqL5TmZlBwcw1x9tBNLciPTy0GKk_NSy2JDw22MDM3NjE0djIyJkIJAKhAMzI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for packing solid organometallic compound and packed container</title><source>esp@cenet</source><creator>HAGA KENICHI ; TOKUDOME KOHICHI ; TOMIYASU SHIZUO</creator><creatorcontrib>HAGA KENICHI ; TOKUDOME KOHICHI ; TOMIYASU SHIZUO</creatorcontrib><description>A method for packing a solid organometallic compound into a container for packing the compound is provided, wherein the solid organometallic compound can be stably supplied to a vapor phase epitaxial growth apparatus such as an MOCVD apparatus at a constant concentration for a long period of time. In the method for packing a solid organometallic compound into a container for packing, the compound is composed of grains having a grain size of 8 mm or less and the grains of the compound essentially comprise grains having a grain size of 2.5 to 6 mm.</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PERFORMING OPERATIONS ; PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140318&DB=EPODOC&CC=US&NR=8673413B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140318&DB=EPODOC&CC=US&NR=8673413B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAGA KENICHI</creatorcontrib><creatorcontrib>TOKUDOME KOHICHI</creatorcontrib><creatorcontrib>TOMIYASU SHIZUO</creatorcontrib><title>Method for packing solid organometallic compound and packed container</title><description>A method for packing a solid organometallic compound into a container for packing the compound is provided, wherein the solid organometallic compound can be stably supplied to a vapor phase epitaxial growth apparatus such as an MOCVD apparatus at a constant concentration for a long period of time. In the method for packing a solid organometallic compound into a container for packing, the compound is composed of grains having a grain size of 8 mm or less and the grains of the compound essentially comprise grains having a grain size of 2.5 to 6 mm.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD1TS3JyE9RSMsvUihITM7OzEtXKM7PyUxRyC9KT8zLz00tSczJyUxWSM7PLcgvzUtRSARikMrUFKBYXkliZl5qEQ8Da1piTnEqL5TmZlBwcw1x9tBNLciPTy0GKk_NSy2JDw22MDM3NjE0djIyJkIJAKhAMzI</recordid><startdate>20140318</startdate><enddate>20140318</enddate><creator>HAGA KENICHI</creator><creator>TOKUDOME KOHICHI</creator><creator>TOMIYASU SHIZUO</creator><scope>EVB</scope></search><sort><creationdate>20140318</creationdate><title>Method for packing solid organometallic compound and packed container</title><author>HAGA KENICHI ; TOKUDOME KOHICHI ; TOMIYASU SHIZUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8673413B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>HAGA KENICHI</creatorcontrib><creatorcontrib>TOKUDOME KOHICHI</creatorcontrib><creatorcontrib>TOMIYASU SHIZUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HAGA KENICHI</au><au>TOKUDOME KOHICHI</au><au>TOMIYASU SHIZUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for packing solid organometallic compound and packed container</title><date>2014-03-18</date><risdate>2014</risdate><abstract>A method for packing a solid organometallic compound into a container for packing the compound is provided, wherein the solid organometallic compound can be stably supplied to a vapor phase epitaxial growth apparatus such as an MOCVD apparatus at a constant concentration for a long period of time. In the method for packing a solid organometallic compound into a container for packing, the compound is composed of grains having a grain size of 8 mm or less and the grains of the compound essentially comprise grains having a grain size of 2.5 to 6 mm.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
title | Method for packing solid organometallic compound and packed container |
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