Wafer-scale package including power source

Wafer-scale package including power source

A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material...

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Hauptverfasser: DAY JOHN K, O'BRIEN RICHARD J, GERRISH PAUL F, MATTES MICHAEL F, RUBEN DAVID A, GRIEF MALCOLM K
Format: Patent
Sprache:eng
Schlagworte:
ELECTROTHERAPY
HUMAN NECESSITIES
HYGIENE
MAGNETOTHERAPY
MEDICAL OR VETERINARY SCIENCE
RADIATION THERAPY
ULTRASOUND THERAPY
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creator DAY JOHN K
O'BRIEN RICHARD J
GERRISH PAUL F
MATTES MICHAEL F
RUBEN DAVID A
GRIEF MALCOLM K
description A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.
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subjects ELECTROTHERAPY
HUMAN NECESSITIES
HYGIENE
MAGNETOTHERAPY
MEDICAL OR VETERINARY SCIENCE
RADIATION THERAPY
ULTRASOUND THERAPY
title Wafer-scale package including power source
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