Die structure, manufacturing method and substrate thereof

A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YANG HAN-PING, HUANG MENGI, LIN CHENG-HSUAN, LIN JIAN-SHIAN, KAO TUNE-HUNE, CHOU MINIEH, PENG JUNG-KANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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