Semiconductor package with single sided substrate design and manufacturing methods thereof

A semiconductor package includes a substrate unit, a die electrically connected to first contact pads, and a package body covering a first patterned conductive layer and the die. The substrate unit includes: (1) the first patterned conductive layer; (2) a first dielectric layer exposing a part of th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SU YUANANG, CHEN CHIANG, HUANG SHIH-FU, LEE MING CHIANG, CHEN TZU-HUI, CHEN KUANG-HSIUNG, HSIEH PAO-MING, APPELT BERND KARL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!