Modular data center
Modular data centers with modular components suitable for use with rack or shelf mount computing systems, for example, are disclosed. The modular center generally includes a modular computing module including an intermodal shipping container and computing systems mounted within the container and con...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | AIGNER GERALD WHITTED WILLIAM H |
| description | Modular data centers with modular components suitable for use with rack or shelf mount computing systems, for example, are disclosed. The modular center generally includes a modular computing module including an intermodal shipping container and computing systems mounted within the container and configured to be shipped and operated within the container and a temperature control system for maintaining the air temperature surrounding the computing systems. The intermodal shipping container may be configured in accordance to International Organization for Standardization (ISO) container manufacturing standards or otherwise configured with respect to height, length, width, weight, and/or lifting points of the container for transport via an intermodal transport infrastructure. The modular design enables the modules to be cost effectively built at a factory and easily transported to and deployed at a data center site. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8549869B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8549869B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8549869B13</originalsourceid><addsrcrecordid>eNrjZBD2zU8pzUksUkhJLElUSE7NK0kt4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFiUBlqSXxocEWpiaWFmaWTobGRCgBANsxIBs</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Modular data center</title><source>esp@cenet</source><creator>AIGNER GERALD ; WHITTED WILLIAM H</creator><creatorcontrib>AIGNER GERALD ; WHITTED WILLIAM H</creatorcontrib><description>Modular data centers with modular components suitable for use with rack or shelf mount computing systems, for example, are disclosed. The modular center generally includes a modular computing module including an intermodal shipping container and computing systems mounted within the container and configured to be shipped and operated within the container and a temperature control system for maintaining the air temperature surrounding the computing systems. The intermodal shipping container may be configured in accordance to International Organization for Standardization (ISO) container manufacturing standards or otherwise configured with respect to height, length, width, weight, and/or lifting points of the container for transport via an intermodal transport infrastructure. The modular design enables the modules to be cost effectively built at a factory and easily transported to and deployed at a data center site.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COLD ROOMS ; COMBINED HEATING AND REFRIGERATION SYSTEMS ; COMPUTING ; COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS ; COUNTING ; CURRENT COLLECTORS ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT PUMP SYSTEMS ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; ICE-BOXES ; LIGHTING ; LINE CONNECTORS ; LIQUEFACTION SOLIDIFICATION OF GASES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MANUFACTURE OR STORAGE OF ICE ; MECHANICAL ENGINEERING ; PHYSICS ; PRINTED CIRCUITS ; REFRIGERATION OR COOLING ; REFRIGERATORS ; WEAPONS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20131008&DB=EPODOC&CC=US&NR=8549869B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20131008&DB=EPODOC&CC=US&NR=8549869B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AIGNER GERALD</creatorcontrib><creatorcontrib>WHITTED WILLIAM H</creatorcontrib><title>Modular data center</title><description>Modular data centers with modular components suitable for use with rack or shelf mount computing systems, for example, are disclosed. The modular center generally includes a modular computing module including an intermodal shipping container and computing systems mounted within the container and configured to be shipped and operated within the container and a temperature control system for maintaining the air temperature surrounding the computing systems. The intermodal shipping container may be configured in accordance to International Organization for Standardization (ISO) container manufacturing standards or otherwise configured with respect to height, length, width, weight, and/or lifting points of the container for transport via an intermodal transport infrastructure. The modular design enables the modules to be cost effectively built at a factory and easily transported to and deployed at a data center site.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COLD ROOMS</subject><subject>COMBINED HEATING AND REFRIGERATION SYSTEMS</subject><subject>COMPUTING</subject><subject>COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS</subject><subject>COUNTING</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT PUMP SYSTEMS</subject><subject>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</subject><subject>HEATING</subject><subject>ICE-BOXES</subject><subject>LIGHTING</subject><subject>LINE CONNECTORS</subject><subject>LIQUEFACTION SOLIDIFICATION OF GASES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MANUFACTURE OR STORAGE OF ICE</subject><subject>MECHANICAL ENGINEERING</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>REFRIGERATION OR COOLING</subject><subject>REFRIGERATORS</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD2zU8pzUksUkhJLElUSE7NK0kt4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFiUBlqSXxocEWpiaWFmaWTobGRCgBANsxIBs</recordid><startdate>20131008</startdate><enddate>20131008</enddate><creator>AIGNER GERALD</creator><creator>WHITTED WILLIAM H</creator><scope>EVB</scope></search><sort><creationdate>20131008</creationdate><title>Modular data center</title><author>AIGNER GERALD ; WHITTED WILLIAM H</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8549869B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COLD ROOMS</topic><topic>COMBINED HEATING AND REFRIGERATION SYSTEMS</topic><topic>COMPUTING</topic><topic>COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS</topic><topic>COUNTING</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT PUMP SYSTEMS</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>ICE-BOXES</topic><topic>LIGHTING</topic><topic>LINE CONNECTORS</topic><topic>LIQUEFACTION SOLIDIFICATION OF GASES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MANUFACTURE OR STORAGE OF ICE</topic><topic>MECHANICAL ENGINEERING</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>REFRIGERATION OR COOLING</topic><topic>REFRIGERATORS</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>AIGNER GERALD</creatorcontrib><creatorcontrib>WHITTED WILLIAM H</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AIGNER GERALD</au><au>WHITTED WILLIAM H</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Modular data center</title><date>2013-10-08</date><risdate>2013</risdate><abstract>Modular data centers with modular components suitable for use with rack or shelf mount computing systems, for example, are disclosed. The modular center generally includes a modular computing module including an intermodal shipping container and computing systems mounted within the container and configured to be shipped and operated within the container and a temperature control system for maintaining the air temperature surrounding the computing systems. The intermodal shipping container may be configured in accordance to International Organization for Standardization (ISO) container manufacturing standards or otherwise configured with respect to height, length, width, weight, and/or lifting points of the container for transport via an intermodal transport infrastructure. The modular design enables the modules to be cost effectively built at a factory and easily transported to and deployed at a data center site.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US8549869B1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS BLASTING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COLD ROOMS COMBINED HEATING AND REFRIGERATION SYSTEMS COMPUTING COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS COUNTING CURRENT COLLECTORS ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT PUMP SYSTEMS HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING ICE-BOXES LIGHTING LINE CONNECTORS LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING PHYSICS PRINTED CIRCUITS REFRIGERATION OR COOLING REFRIGERATORS WEAPONS |
| title | Modular data center |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-10T06%3A48%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=AIGNER%20GERALD&rft.date=2013-10-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8549869B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |