Thermo-compression bonded electrical interconnect structure and method

An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAH JAE-WOONG, FURMAN BRUCE K
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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