System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure

The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BARNIDGE TRACY J, SAMPICA JAMES D, MARZEN VINCENT P, NEMETH PAUL R
Format: Patent
Sprache:eng
Schlagworte:
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