Heat sink interface having three-dimensional tolerance compensation
A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of el...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MARTINEZ MICHAEL P ELLSWORTH JOSEPH R PAQUETTE JEFFREY TRAHAN MICHAEL R CHEYNE SCOTT R |
| description | A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8537552B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8537552B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8537552B23</originalsourceid><addsrcrecordid>eNrjZHD2SE0sUSjOzMtWyMwrSS1KS0xOVchILMvMS1coyShKTdVNycxNzSvOzM9LzFEoyc9JLUrMAypJzs8tAAonlgAleBhY0xJzilN5oTQ3g4Kba4izh25qQX58anEB0Mi81JL40GALU2NzU1MjJyNjIpQAAE7CMsw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Heat sink interface having three-dimensional tolerance compensation</title><source>esp@cenet</source><creator>MARTINEZ MICHAEL P ; ELLSWORTH JOSEPH R ; PAQUETTE JEFFREY ; TRAHAN MICHAEL R ; CHEYNE SCOTT R</creator><creatorcontrib>MARTINEZ MICHAEL P ; ELLSWORTH JOSEPH R ; PAQUETTE JEFFREY ; TRAHAN MICHAEL R ; CHEYNE SCOTT R</creatorcontrib><description>A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.</description><language>eng</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; WEAPONS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130917&DB=EPODOC&CC=US&NR=8537552B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130917&DB=EPODOC&CC=US&NR=8537552B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MARTINEZ MICHAEL P</creatorcontrib><creatorcontrib>ELLSWORTH JOSEPH R</creatorcontrib><creatorcontrib>PAQUETTE JEFFREY</creatorcontrib><creatorcontrib>TRAHAN MICHAEL R</creatorcontrib><creatorcontrib>CHEYNE SCOTT R</creatorcontrib><title>Heat sink interface having three-dimensional tolerance compensation</title><description>A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD2SE0sUSjOzMtWyMwrSS1KS0xOVchILMvMS1coyShKTdVNycxNzSvOzM9LzFEoyc9JLUrMAypJzs8tAAonlgAleBhY0xJzilN5oTQ3g4Kba4izh25qQX58anEB0Mi81JL40GALU2NzU1MjJyNjIpQAAE7CMsw</recordid><startdate>20130917</startdate><enddate>20130917</enddate><creator>MARTINEZ MICHAEL P</creator><creator>ELLSWORTH JOSEPH R</creator><creator>PAQUETTE JEFFREY</creator><creator>TRAHAN MICHAEL R</creator><creator>CHEYNE SCOTT R</creator><scope>EVB</scope></search><sort><creationdate>20130917</creationdate><title>Heat sink interface having three-dimensional tolerance compensation</title><author>MARTINEZ MICHAEL P ; ELLSWORTH JOSEPH R ; PAQUETTE JEFFREY ; TRAHAN MICHAEL R ; CHEYNE SCOTT R</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8537552B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>MARTINEZ MICHAEL P</creatorcontrib><creatorcontrib>ELLSWORTH JOSEPH R</creatorcontrib><creatorcontrib>PAQUETTE JEFFREY</creatorcontrib><creatorcontrib>TRAHAN MICHAEL R</creatorcontrib><creatorcontrib>CHEYNE SCOTT R</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MARTINEZ MICHAEL P</au><au>ELLSWORTH JOSEPH R</au><au>PAQUETTE JEFFREY</au><au>TRAHAN MICHAEL R</au><au>CHEYNE SCOTT R</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat sink interface having three-dimensional tolerance compensation</title><date>2013-09-17</date><risdate>2013</risdate><abstract>A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US8537552B2 |
| source | esp@cenet |
| subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS |
| title | Heat sink interface having three-dimensional tolerance compensation |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-14T04%3A20%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MARTINEZ%20MICHAEL%20P&rft.date=2013-09-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8537552B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |