Providing an automatic optical inspection feature for solder joints on semiconductor packages

A mechanism is provided by which optically-inspectable features formed during surface mount bonding of no-leads packages are enhanced. Embodiments of the present invention use a lead frame having features that will lie upon the edges of the finished semiconductor device package, where molding materi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	O'BRIEN PAMELA A, ABDO DAVID F
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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