Semiconductor device, electronic apparatus and semiconductor device fabricating method
There is provided a semiconductor device which includes a primary semiconductor chip 11, a secondary semiconductor chip 12 stacked on the primary semiconductor chip 11, primary external connecting terminals 16 which are electrically connected with the primary semiconductor chip 11 via wires 21, seco...
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| creator | GOMYO TOSHIO TAKEUCHI YUKIHARU TOYAZAKI HIROKI TAKAYANAGI HIDENORI |
| description | There is provided a semiconductor device which includes a primary semiconductor chip 11, a secondary semiconductor chip 12 stacked on the primary semiconductor chip 11, primary external connecting terminals 16 which are electrically connected with the primary semiconductor chip 11 via wires 21, secondary external connecting terminals 17 which are electrically connected with the secondary semiconductor chip 12 via wires 22 and primary and secondary low-elasticity resins 13, 15 which seal the primary and secondary semiconductor chips 11, 12 in such a manner as to cover them. |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Semiconductor device, electronic apparatus and semiconductor device fabricating method |
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