Electronic assemblies without solder and methods for their manufacture

Electronic assemblies without solder and methods for their manufacture

A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the fi...

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1. Verfasser: FJELSTAD JOSEPH C
Format: Patent
Sprache:eng
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LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
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creator FJELSTAD JOSEPH C
description A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8510935B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8510935B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8510935B23</originalsourceid><addsrcrecordid>eNqNyk0KwjAQhuFsXIh6h7mAoJaCbist7tV1GZOvNJCfkpng9XXhAVy98PCuzdAHWC05eUssgvgKHkJvr3OuSpKDQyFOjiK-5ISmXEhn-EKRU53Yai3YmtXEQbD7dWNo6B_X2x5LHiELWyTo-Lyf2-Ph0rTdqflj-QAWnTPv</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic assemblies without solder and methods for their manufacture</title><source>esp@cenet</source><creator>FJELSTAD JOSEPH C</creator><creatorcontrib>FJELSTAD JOSEPH C</creatorcontrib><description>A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.</description><language>eng</language><subject>LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; TRANSPORTING</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130820&amp;DB=EPODOC&amp;CC=US&amp;NR=8510935B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130820&amp;DB=EPODOC&amp;CC=US&amp;NR=8510935B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FJELSTAD JOSEPH C</creatorcontrib><title>Electronic assemblies without solder and methods for their manufacture</title><description>A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.</description><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyk0KwjAQhuFsXIh6h7mAoJaCbist7tV1GZOvNJCfkpng9XXhAVy98PCuzdAHWC05eUssgvgKHkJvr3OuSpKDQyFOjiK-5ISmXEhn-EKRU53Yai3YmtXEQbD7dWNo6B_X2x5LHiELWyTo-Lyf2-Ph0rTdqflj-QAWnTPv</recordid><startdate>20130820</startdate><enddate>20130820</enddate><creator>FJELSTAD JOSEPH C</creator><scope>EVB</scope></search><sort><creationdate>20130820</creationdate><title>Electronic assemblies without solder and methods for their manufacture</title><author>FJELSTAD JOSEPH C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8510935B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FJELSTAD JOSEPH C</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FJELSTAD JOSEPH C</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic assemblies without solder and methods for their manufacture</title><date>2013-08-20</date><risdate>2013</risdate><abstract>A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.</abstract><oa>free_for_read</oa></addata></record>
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subjects LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
title Electronic assemblies without solder and methods for their manufacture
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T16%3A49%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FJELSTAD%20JOSEPH%20C&rft.date=2013-08-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8510935B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true