Packaging system with hollow package and method for the same

Packaging system with hollow package and method for the same

A packaging system comprising: forming terminal leads; configuring a cavity by partially encapsulating the terminal leads with a compound; attaching an integrated circuit device, a micro-electromechanical system, a micro-mechanical system, or a combination thereof in the cavity; and bonding a cover...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BATHAN HENRY DESCALZO, CAMACHO ZIGMUND RAMIREZ, TAY LIONEL CHIEN HUI, PUNZALAN JEFFREY D
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator BATHAN HENRY DESCALZO
CAMACHO ZIGMUND RAMIREZ
TAY LIONEL CHIEN HUI
PUNZALAN JEFFREY D
description A packaging system comprising: forming terminal leads; configuring a cavity by partially encapsulating the terminal leads with a compound; attaching an integrated circuit device, a micro-electromechanical system, a micro-mechanical system, or a combination thereof in the cavity; and bonding a cover to the terminal leads for enclosing the cavity.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8493748B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8493748B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8493748B23</originalsourceid><addsrcrecordid>eNrjZLAJSEzOTkzPzEtXKK4sLknNVSjPLMlQyMjPyckvVygAS6YqJOalKOSmlmTkpyik5RcplGSkKhQn5qbyMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjUYqDu1LzUkvjQYAsTS2NzEwsnI2MilAAAc0kvVA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Packaging system with hollow package and method for the same</title><source>esp@cenet</source><creator>BATHAN HENRY DESCALZO ; CAMACHO ZIGMUND RAMIREZ ; TAY LIONEL CHIEN HUI ; PUNZALAN JEFFREY D</creator><creatorcontrib>BATHAN HENRY DESCALZO ; CAMACHO ZIGMUND RAMIREZ ; TAY LIONEL CHIEN HUI ; PUNZALAN JEFFREY D</creatorcontrib><description>A packaging system comprising: forming terminal leads; configuring a cavity by partially encapsulating the terminal leads with a compound; attaching an integrated circuit device, a micro-electromechanical system, a micro-mechanical system, or a combination thereof in the cavity; and bonding a cover to the terminal leads for enclosing the cavity.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130723&amp;DB=EPODOC&amp;CC=US&amp;NR=8493748B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130723&amp;DB=EPODOC&amp;CC=US&amp;NR=8493748B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BATHAN HENRY DESCALZO</creatorcontrib><creatorcontrib>CAMACHO ZIGMUND RAMIREZ</creatorcontrib><creatorcontrib>TAY LIONEL CHIEN HUI</creatorcontrib><creatorcontrib>PUNZALAN JEFFREY D</creatorcontrib><title>Packaging system with hollow package and method for the same</title><description>A packaging system comprising: forming terminal leads; configuring a cavity by partially encapsulating the terminal leads with a compound; attaching an integrated circuit device, a micro-electromechanical system, a micro-mechanical system, or a combination thereof in the cavity; and bonding a cover to the terminal leads for enclosing the cavity.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAJSEzOTkzPzEtXKK4sLknNVSjPLMlQyMjPyckvVygAS6YqJOalKOSmlmTkpyik5RcplGSkKhQn5qbyMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjUYqDu1LzUkvjQYAsTS2NzEwsnI2MilAAAc0kvVA</recordid><startdate>20130723</startdate><enddate>20130723</enddate><creator>BATHAN HENRY DESCALZO</creator><creator>CAMACHO ZIGMUND RAMIREZ</creator><creator>TAY LIONEL CHIEN HUI</creator><creator>PUNZALAN JEFFREY D</creator><scope>EVB</scope></search><sort><creationdate>20130723</creationdate><title>Packaging system with hollow package and method for the same</title><author>BATHAN HENRY DESCALZO ; CAMACHO ZIGMUND RAMIREZ ; TAY LIONEL CHIEN HUI ; PUNZALAN JEFFREY D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8493748B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>BATHAN HENRY DESCALZO</creatorcontrib><creatorcontrib>CAMACHO ZIGMUND RAMIREZ</creatorcontrib><creatorcontrib>TAY LIONEL CHIEN HUI</creatorcontrib><creatorcontrib>PUNZALAN JEFFREY D</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BATHAN HENRY DESCALZO</au><au>CAMACHO ZIGMUND RAMIREZ</au><au>TAY LIONEL CHIEN HUI</au><au>PUNZALAN JEFFREY D</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Packaging system with hollow package and method for the same</title><date>2013-07-23</date><risdate>2013</risdate><abstract>A packaging system comprising: forming terminal leads; configuring a cavity by partially encapsulating the terminal leads with a compound; attaching an integrated circuit device, a micro-electromechanical system, a micro-mechanical system, or a combination thereof in the cavity; and bonding a cover to the terminal leads for enclosing the cavity.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US8493748B2
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Packaging system with hollow package and method for the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-22T04%3A05%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BATHAN%20HENRY%20DESCALZO&rft.date=2013-07-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8493748B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true