Conductive sidewall for microbumps

Electromigration in microbump connections causes voids in the microbumps, which reduces the lifetime of an integrated circuit containing the microbump. Electromigration lifetime may be increased in microbumps by forming a copper shell around the solder. The copper shell of one microbump contacts the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GU SHIQUN, HAU-RIEGE CHRISTINE S, CHANDRASEKARAN ARVIND
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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