Self-aligned nano-scale device with parallel plate electrodes

A contiguous deep trench includes a first trench portion having a constant width between a pair of first parallel sidewalls, second and third trench portions each having a greater width than the first trench portion and laterally connected to the first trench portion. A non-conformal deposition proc...

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Hauptverfasser: QUON ROGER A, SAPP BRIAN C, PETRARCA KEVIN S, RADENS CARL J, CLEVENGER LAWRENCE A, LI ZHENGWEN
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creator QUON ROGER A
SAPP BRIAN C
PETRARCA KEVIN S
RADENS CARL J
CLEVENGER LAWRENCE A
LI ZHENGWEN
description A contiguous deep trench includes a first trench portion having a constant width between a pair of first parallel sidewalls, second and third trench portions each having a greater width than the first trench portion and laterally connected to the first trench portion. A non-conformal deposition process is employed to form a conductive layer that has a tapered geometry within the contiguous deep trench portion such that the conductive layer is not present on bottom surfaces of the contiguous deep trench. A gap fill layer is formed to plug the space in the first trench portion. The conductive layer is patterned into two conductive plates each having a tapered vertical portion within the first trench portion. After removing remaining portions of the gap fill layer, a device is formed that has a small separation distance between the tapered vertical portions of the conductive plates.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8476530B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8476530B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8476530B23</originalsourceid><addsrcrecordid>eNqNyr0KwjAUBtAsDqK-w32BQLH-LS4Wxb06l0vytQY-ktAEfX0XH8DpLGdpzj04WmWYIrxEjckWp4R4vIODfEJ9SdZZSVAytUJAuDonj7I2i1FZsPm5MnK7Prq7RU4DSlaHiDo8-9PueNi3zWXb_lG-sGAv3Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Self-aligned nano-scale device with parallel plate electrodes</title><source>esp@cenet</source><creator>QUON ROGER A ; SAPP BRIAN C ; PETRARCA KEVIN S ; RADENS CARL J ; CLEVENGER LAWRENCE A ; LI ZHENGWEN</creator><creatorcontrib>QUON ROGER A ; SAPP BRIAN C ; PETRARCA KEVIN S ; RADENS CARL J ; CLEVENGER LAWRENCE A ; LI ZHENGWEN</creatorcontrib><description>A contiguous deep trench includes a first trench portion having a constant width between a pair of first parallel sidewalls, second and third trench portions each having a greater width than the first trench portion and laterally connected to the first trench portion. A non-conformal deposition process is employed to form a conductive layer that has a tapered geometry within the contiguous deep trench portion such that the conductive layer is not present on bottom surfaces of the contiguous deep trench. A gap fill layer is formed to plug the space in the first trench portion. The conductive layer is patterned into two conductive plates each having a tapered vertical portion within the first trench portion. After removing remaining portions of the gap fill layer, a device is formed that has a small separation distance between the tapered vertical portions of the conductive plates.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; TRANSPORTING</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130702&amp;DB=EPODOC&amp;CC=US&amp;NR=8476530B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130702&amp;DB=EPODOC&amp;CC=US&amp;NR=8476530B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>QUON ROGER A</creatorcontrib><creatorcontrib>SAPP BRIAN C</creatorcontrib><creatorcontrib>PETRARCA KEVIN S</creatorcontrib><creatorcontrib>RADENS CARL J</creatorcontrib><creatorcontrib>CLEVENGER LAWRENCE A</creatorcontrib><creatorcontrib>LI ZHENGWEN</creatorcontrib><title>Self-aligned nano-scale device with parallel plate electrodes</title><description>A contiguous deep trench includes a first trench portion having a constant width between a pair of first parallel sidewalls, second and third trench portions each having a greater width than the first trench portion and laterally connected to the first trench portion. A non-conformal deposition process is employed to form a conductive layer that has a tapered geometry within the contiguous deep trench portion such that the conductive layer is not present on bottom surfaces of the contiguous deep trench. A gap fill layer is formed to plug the space in the first trench portion. The conductive layer is patterned into two conductive plates each having a tapered vertical portion within the first trench portion. After removing remaining portions of the gap fill layer, a device is formed that has a small separation distance between the tapered vertical portions of the conductive plates.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyr0KwjAUBtAsDqK-w32BQLH-LS4Wxb06l0vytQY-ktAEfX0XH8DpLGdpzj04WmWYIrxEjckWp4R4vIODfEJ9SdZZSVAytUJAuDonj7I2i1FZsPm5MnK7Prq7RU4DSlaHiDo8-9PueNi3zWXb_lG-sGAv3Q</recordid><startdate>20130702</startdate><enddate>20130702</enddate><creator>QUON ROGER A</creator><creator>SAPP BRIAN C</creator><creator>PETRARCA KEVIN S</creator><creator>RADENS CARL J</creator><creator>CLEVENGER LAWRENCE A</creator><creator>LI ZHENGWEN</creator><scope>EVB</scope></search><sort><creationdate>20130702</creationdate><title>Self-aligned nano-scale device with parallel plate electrodes</title><author>QUON ROGER A ; SAPP BRIAN C ; PETRARCA KEVIN S ; RADENS CARL J ; CLEVENGER LAWRENCE A ; LI ZHENGWEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8476530B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>QUON ROGER A</creatorcontrib><creatorcontrib>SAPP BRIAN C</creatorcontrib><creatorcontrib>PETRARCA KEVIN S</creatorcontrib><creatorcontrib>RADENS CARL J</creatorcontrib><creatorcontrib>CLEVENGER LAWRENCE A</creatorcontrib><creatorcontrib>LI ZHENGWEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>QUON ROGER A</au><au>SAPP BRIAN C</au><au>PETRARCA KEVIN S</au><au>RADENS CARL J</au><au>CLEVENGER LAWRENCE A</au><au>LI ZHENGWEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Self-aligned nano-scale device with parallel plate electrodes</title><date>2013-07-02</date><risdate>2013</risdate><abstract>A contiguous deep trench includes a first trench portion having a constant width between a pair of first parallel sidewalls, second and third trench portions each having a greater width than the first trench portion and laterally connected to the first trench portion. A non-conformal deposition process is employed to form a conductive layer that has a tapered geometry within the contiguous deep trench portion such that the conductive layer is not present on bottom surfaces of the contiguous deep trench. A gap fill layer is formed to plug the space in the first trench portion. The conductive layer is patterned into two conductive plates each having a tapered vertical portion within the first trench portion. After removing remaining portions of the gap fill layer, a device is formed that has a small separation distance between the tapered vertical portions of the conductive plates.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
ELECTRICITY
INSULATORS
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
TRANSPORTING
title Self-aligned nano-scale device with parallel plate electrodes
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