Electronic device having interconnections, openings, and pads having greater width than the openings

Electronic device having interconnections, openings, and pads having greater width than the openings

An electronic device includes first and second interconnections formed on a first surface of a substrate and spaced apart from each other. The electronic device includes a first insulating material layer disposed on the substrate including the first and second interconnections and including a first...

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Hauptverfasser: JO SANG-GUI, BAE KWANG-JIN, PARK JI-YONG, LEE HEE-SEOK, KIM CHUL-WOO, KIM SEUNG-HWAN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator JO SANG-GUI
BAE KWANG-JIN
PARK JI-YONG
LEE HEE-SEOK
KIM CHUL-WOO
KIM SEUNG-HWAN
description An electronic device includes first and second interconnections formed on a first surface of a substrate and spaced apart from each other. The electronic device includes a first insulating material layer disposed on the substrate including the first and second interconnections and including a first opening exposing a predetermined region of the first interconnection. The electronic device further includes a first pad filling the first opening and having a greater width than the first opening. The first pad covers at least a part of the second interconnection adjacent to one end of the first interconnection, and the first pad is electrically insulated from the second interconnection by the first insulating material layer.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Electronic device having interconnections, openings, and pads having greater width than the openings
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