Differential pressure sensor device
A MEMS differential pressure sensing element is provided by two separate silicon dies attached to opposite sides of a silicon or glass spacer. The spacer is hollow. If the spacer is silicon, the dies are preferably attached to the hollow spacer using silicon-to-silicon bonding provided in part by si...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | CHIOU JEN-HUANG ALBERT |
description | A MEMS differential pressure sensing element is provided by two separate silicon dies attached to opposite sides of a silicon or glass spacer. The spacer is hollow. If the spacer is silicon, the dies are preferably attached to the hollow spacer using silicon-to-silicon bonding provided in part by silicon oxide layers. If the spacer is glass, the dies can be attached to the hollow spacer using anodic bonding. Conductive vias extend through the layers and provide electrical connections between Wheatstone bridge circuits formed from piezoresistors in the silicon dies. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8466523B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8466523B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8466523B23</originalsourceid><addsrcrecordid>eNrjZFB2yUxLSy1KzSvJTMxRKChKLS4uLUpVKE7NK84vUkhJLctMTuVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwRYmZmamRsZORsZEKAEAwOUmkA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Differential pressure sensor device</title><source>esp@cenet</source><creator>CHIOU JEN-HUANG ALBERT</creator><creatorcontrib>CHIOU JEN-HUANG ALBERT</creatorcontrib><description>A MEMS differential pressure sensing element is provided by two separate silicon dies attached to opposite sides of a silicon or glass spacer. The spacer is hollow. If the spacer is silicon, the dies are preferably attached to the hollow spacer using silicon-to-silicon bonding provided in part by silicon oxide layers. If the spacer is glass, the dies can be attached to the hollow spacer using anodic bonding. Conductive vias extend through the layers and provide electrical connections between Wheatstone bridge circuits formed from piezoresistors in the silicon dies.</description><language>eng</language><subject>MEASURING ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; PHYSICS ; TESTING</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130618&DB=EPODOC&CC=US&NR=8466523B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130618&DB=EPODOC&CC=US&NR=8466523B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHIOU JEN-HUANG ALBERT</creatorcontrib><title>Differential pressure sensor device</title><description>A MEMS differential pressure sensing element is provided by two separate silicon dies attached to opposite sides of a silicon or glass spacer. The spacer is hollow. If the spacer is silicon, the dies are preferably attached to the hollow spacer using silicon-to-silicon bonding provided in part by silicon oxide layers. If the spacer is glass, the dies can be attached to the hollow spacer using anodic bonding. Conductive vias extend through the layers and provide electrical connections between Wheatstone bridge circuits formed from piezoresistors in the silicon dies.</description><subject>MEASURING</subject><subject>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB2yUxLSy1KzSvJTMxRKChKLS4uLUpVKE7NK84vUkhJLctMTuVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwRYmZmamRsZORsZEKAEAwOUmkA</recordid><startdate>20130618</startdate><enddate>20130618</enddate><creator>CHIOU JEN-HUANG ALBERT</creator><scope>EVB</scope></search><sort><creationdate>20130618</creationdate><title>Differential pressure sensor device</title><author>CHIOU JEN-HUANG ALBERT</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8466523B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>MEASURING</topic><topic>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>CHIOU JEN-HUANG ALBERT</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHIOU JEN-HUANG ALBERT</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Differential pressure sensor device</title><date>2013-06-18</date><risdate>2013</risdate><abstract>A MEMS differential pressure sensing element is provided by two separate silicon dies attached to opposite sides of a silicon or glass spacer. The spacer is hollow. If the spacer is silicon, the dies are preferably attached to the hollow spacer using silicon-to-silicon bonding provided in part by silicon oxide layers. If the spacer is glass, the dies can be attached to the hollow spacer using anodic bonding. Conductive vias extend through the layers and provide electrical connections between Wheatstone bridge circuits formed from piezoresistors in the silicon dies.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US8466523B2 |
source | esp@cenet |
subjects | MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS TESTING |
title | Differential pressure sensor device |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T04%3A32%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHIOU%20JEN-HUANG%20ALBERT&rft.date=2013-06-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8466523B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |