Method for manufacturing multilayer flexible printed circuit board

A method for manufacturing a multilayer FPCB which includes providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the seco...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TU CHIH-YI, ZHANG JUN-QING, HUANG SZU-MIN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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