Light emitting diode package and manufacturing method thereof

Light emitting diode package and manufacturing method thereof

The present invention relates to a light emitting diode package and a manufacturing method thereof. The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface o...

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Hauptverfasser: PARKNA, JOO SEONG AH, PARK IL WOO, KWAK CHANG HOON
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator PARKNA
JOO SEONG AH
PARK IL WOO
KWAK CHANG HOON
description The present invention relates to a light emitting diode package and a manufacturing method thereof. The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Light emitting diode package and manufacturing method thereof
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