Method of forming openings in a semiconductor device and a semiconductor device fabricated by the method

A method of forming openings to a layer of a semiconductor device comprises forming a dielectric layer over the layer of the semiconductor device, and forming a mask over the dielectric layer. The mask comprises a plurality of mask openings arranged in a regular pattern extending over the dielectric...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WARRICK SCOTT, CONLEY WILL, AMINPUR MASSUD ABUBAKER, RIVIERE-CAZEAUX LIONEL
Format: Patent
Sprache:eng
Schlagworte:
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