Electronic component for an electronic carrier substrate

Disclosed are an electronic component, an assembly of an electronic component and an electronic carrier substrate, and a method of connecting the electronic component to the carrier substrate. The carrier substrate has a first coefficient of thermal expansion (CTE), and the electronic component has...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DOMITROVITS MICHAEL J, FRIZZELL, JR. RAYMOND F, DONNELLY EDWARD J
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!