Identification of dies on a semiconductor wafer

A semiconductor wafer includes multiple dies and a die identification region adjacent to or on each die. The die identification region can include a wafer indicator and a pattern of die locations representing die locations on the wafer. A die identification marker is provided in each pattern of die...

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Hauptverfasser: MEISENZAHL ERIC J, WANG SHEN, PACE LAUREL J, DORAN JAMES E, FABINSKI ROBERT P
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creator MEISENZAHL ERIC J
WANG SHEN
PACE LAUREL J
DORAN JAMES E
FABINSKI ROBERT P
description A semiconductor wafer includes multiple dies and a die identification region adjacent to or on each die. The die identification region can include a wafer indicator and a pattern of die locations representing die locations on the wafer. A die identification marker is provided in each pattern of die locations in the die identification region specifying a location of a respective die on the wafer.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8415813B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8415813B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8415813B23</originalsourceid><addsrcrecordid>eNrjZND3TEnNK8lMy0xOLMnMz1PIT1NIyUwtVgAyExWKU3Mzk_PzUkqTS_KLFMoT01KLeBhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJfGiwhYmhqYWhsZORMRFKANKZKpo</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Identification of dies on a semiconductor wafer</title><source>esp@cenet</source><creator>MEISENZAHL ERIC J ; WANG SHEN ; PACE LAUREL J ; DORAN JAMES E ; FABINSKI ROBERT P</creator><creatorcontrib>MEISENZAHL ERIC J ; WANG SHEN ; PACE LAUREL J ; DORAN JAMES E ; FABINSKI ROBERT P</creatorcontrib><description>A semiconductor wafer includes multiple dies and a die identification region adjacent to or on each die. The die identification region can include a wafer indicator and a pattern of die locations representing die locations on the wafer. A die identification marker is provided in each pattern of die locations in the die identification region specifying a location of a respective die on the wafer.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130409&amp;DB=EPODOC&amp;CC=US&amp;NR=8415813B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130409&amp;DB=EPODOC&amp;CC=US&amp;NR=8415813B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MEISENZAHL ERIC J</creatorcontrib><creatorcontrib>WANG SHEN</creatorcontrib><creatorcontrib>PACE LAUREL J</creatorcontrib><creatorcontrib>DORAN JAMES E</creatorcontrib><creatorcontrib>FABINSKI ROBERT P</creatorcontrib><title>Identification of dies on a semiconductor wafer</title><description>A semiconductor wafer includes multiple dies and a die identification region adjacent to or on each die. The die identification region can include a wafer indicator and a pattern of die locations representing die locations on the wafer. A die identification marker is provided in each pattern of die locations in the die identification region specifying a location of a respective die on the wafer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND3TEnNK8lMy0xOLMnMz1PIT1NIyUwtVgAyExWKU3Mzk_PzUkqTS_KLFMoT01KLeBhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJfGiwhYmhqYWhsZORMRFKANKZKpo</recordid><startdate>20130409</startdate><enddate>20130409</enddate><creator>MEISENZAHL ERIC J</creator><creator>WANG SHEN</creator><creator>PACE LAUREL J</creator><creator>DORAN JAMES E</creator><creator>FABINSKI ROBERT P</creator><scope>EVB</scope></search><sort><creationdate>20130409</creationdate><title>Identification of dies on a semiconductor wafer</title><author>MEISENZAHL ERIC J ; WANG SHEN ; PACE LAUREL J ; DORAN JAMES E ; FABINSKI ROBERT P</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8415813B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MEISENZAHL ERIC J</creatorcontrib><creatorcontrib>WANG SHEN</creatorcontrib><creatorcontrib>PACE LAUREL J</creatorcontrib><creatorcontrib>DORAN JAMES E</creatorcontrib><creatorcontrib>FABINSKI ROBERT P</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MEISENZAHL ERIC J</au><au>WANG SHEN</au><au>PACE LAUREL J</au><au>DORAN JAMES E</au><au>FABINSKI ROBERT P</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Identification of dies on a semiconductor wafer</title><date>2013-04-09</date><risdate>2013</risdate><abstract>A semiconductor wafer includes multiple dies and a die identification region adjacent to or on each die. The die identification region can include a wafer indicator and a pattern of die locations representing die locations on the wafer. A die identification marker is provided in each pattern of die locations in the die identification region specifying a location of a respective die on the wafer.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Identification of dies on a semiconductor wafer
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T22%3A44%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MEISENZAHL%20ERIC%20J&rft.date=2013-04-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8415813B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true