Inductive structure and method of forming the inductive structure with an attached core structure

Inductive structure and method of forming the inductive structure with an attached core structure

An inductor is formed on a wafer by attaching a first core structure to the wafer with a pick and place operation, forming a coil with one or more thick metal layers over the first core structure, and then attaching a second core structure to the first core structure with the pick and place operatio...

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Hauptverfasser: SMEYS PETER, PAPOU ANDREI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
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PAPOU ANDREI
description An inductor is formed on a wafer by attaching a first core structure to the wafer with a pick and place operation, forming a coil with one or more thick metal layers over the first core structure, and then attaching a second core structure to the first core structure with the pick and place operation after the coil has been formed. In addition, the pick and place operation can also be used to attach one or more integrated circuits to the wafer to form an integrated inductive device.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8410576B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8410576B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8410576B23</originalsourceid><addsrcrecordid>eNrjZEj0zEspTS7JLEtVKC4pArJKi1IVEvNSFHJTSzLyUxTy0xTS8otyM_PSFUoyUhUysaguzyzJAGpRSCwpSUzOSE1RSM4vQpLnYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocEWJoYGpuZmTkbGRCgBAPQfPi8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Inductive structure and method of forming the inductive structure with an attached core structure</title><source>esp@cenet</source><creator>SMEYS PETER ; PAPOU ANDREI</creator><creatorcontrib>SMEYS PETER ; PAPOU ANDREI</creatorcontrib><description>An inductor is formed on a wafer by attaching a first core structure to the wafer with a pick and place operation, forming a coil with one or more thick metal layers over the first core structure, and then attaching a second core structure to the first core structure with the pick and place operation after the coil has been formed. In addition, the pick and place operation can also be used to attach one or more integrated circuits to the wafer to form an integrated inductive device.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRICITY ; INDUCTANCES ; MAGNETS ; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ; TRANSFORMERS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130402&amp;DB=EPODOC&amp;CC=US&amp;NR=8410576B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130402&amp;DB=EPODOC&amp;CC=US&amp;NR=8410576B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SMEYS PETER</creatorcontrib><creatorcontrib>PAPOU ANDREI</creatorcontrib><title>Inductive structure and method of forming the inductive structure with an attached core structure</title><description>An inductor is formed on a wafer by attaching a first core structure to the wafer with a pick and place operation, forming a coil with one or more thick metal layers over the first core structure, and then attaching a second core structure to the first core structure with the pick and place operation after the coil has been formed. In addition, the pick and place operation can also be used to attach one or more integrated circuits to the wafer to form an integrated inductive device.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRICITY</subject><subject>INDUCTANCES</subject><subject>MAGNETS</subject><subject>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</subject><subject>TRANSFORMERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEj0zEspTS7JLEtVKC4pArJKi1IVEvNSFHJTSzLyUxTy0xTS8otyM_PSFUoyUhUysaguzyzJAGpRSCwpSUzOSE1RSM4vQpLnYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocEWJoYGpuZmTkbGRCgBAPQfPi8</recordid><startdate>20130402</startdate><enddate>20130402</enddate><creator>SMEYS PETER</creator><creator>PAPOU ANDREI</creator><scope>EVB</scope></search><sort><creationdate>20130402</creationdate><title>Inductive structure and method of forming the inductive structure with an attached core structure</title><author>SMEYS PETER ; PAPOU ANDREI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8410576B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRICITY</topic><topic>INDUCTANCES</topic><topic>MAGNETS</topic><topic>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</topic><topic>TRANSFORMERS</topic><toplevel>online_resources</toplevel><creatorcontrib>SMEYS PETER</creatorcontrib><creatorcontrib>PAPOU ANDREI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SMEYS PETER</au><au>PAPOU ANDREI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Inductive structure and method of forming the inductive structure with an attached core structure</title><date>2013-04-02</date><risdate>2013</risdate><abstract>An inductor is formed on a wafer by attaching a first core structure to the wafer with a pick and place operation, forming a coil with one or more thick metal layers over the first core structure, and then attaching a second core structure to the first core structure with the pick and place operation after the coil has been formed. In addition, the pick and place operation can also be used to attach one or more integrated circuits to the wafer to form an integrated inductive device.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
title Inductive structure and method of forming the inductive structure with an attached core structure
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T02%3A17%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SMEYS%20PETER&rft.date=2013-04-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8410576B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true