Through-substrate via and redistribution layer with metal paste

A semiconductor device and a method for manufacturing such semiconductor device for use in a stacked configuration of the semiconductor device are disclosed. The semiconductor device includes a substrate including at least part of an electronic circuit provided at a first side thereof. The substrate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	VAN GRUNSVEN ERIC CORNELIS EGBERTUS, BURGHOORN MARIA MATHEA ANTONETTA, SANDERS FRANCISCUS HUBERTUS MARIE, ROOZEBOOM FREDDY
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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