Foil-based method for packaging intergrated circuits

One aspect of the present invention involves a foil-based method for packaging integrated circuits. Initially, a metallic foil and a photoresist layer are attached with a carrier. The photoresist layer is exposed and patterned. Afterward, multiple integrated circuit dice are connected to the foil. T...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NGUYEN HAU, TU NGHIA T, PODDAR ANINYDA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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