Semiconductor device packages with electromagnetic interference shielding

Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a circuit substrate, an electronic device, an encapsulant, and a conductive coating. The circuit substrate includes a carrying surface, a bottom surfa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM SEOKBONG, LEE YUYONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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