Die bonding utilizing a patterned adhesion layer

An electronic package and method and system for forming the electronic package. The electronic package has a first substrate including a first electronic device and including through-holes extending through an entire thickness of the first substrate. The electronic package has a second substrate bon...

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Hauptverfasser: LUECK MATTHEW R, MALTA DEAN M, TEMPLE DOROTA, VICK ERIK P
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creator LUECK MATTHEW R
MALTA DEAN M
TEMPLE DOROTA
VICK ERIK P
description An electronic package and method and system for forming the electronic package. The electronic package has a first substrate including a first electronic device and including through-holes extending through an entire thickness of the first substrate. The electronic package has a second substrate bonded to the first substrate, metallizations formed in the through-holes of the first substrate to connect to components of the first electronic device, and a patternable substance disposed between the first substrate and the second substrate and adhering the first substrate and the second substrate together in regions apart from the metallizations. The method and system form through-holes extending through an entire thickness of the first substrate, deposit and pattern an adherable substance on the second substrate in a pattern having openings which expose connections for a second electronic device of the second substrate, align and attach the first substrate and the second substrate together, and form metallizations in the through-holes to connect to the connections for the second electronic device.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8361901B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8361901B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8361901B23</originalsourceid><addsrcrecordid>eNrjZDBwyUxVSMrPS8nMS1coLcnMyawCsRIVChJLSlKL8lJTFBJTMlKLM_PzFHISK1OLeBhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJfGiwhbGZoaWBoZORMRFKAAbeKwM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Die bonding utilizing a patterned adhesion layer</title><source>esp@cenet</source><creator>LUECK MATTHEW R ; MALTA DEAN M ; TEMPLE DOROTA ; VICK ERIK P</creator><creatorcontrib>LUECK MATTHEW R ; MALTA DEAN M ; TEMPLE DOROTA ; VICK ERIK P</creatorcontrib><description>An electronic package and method and system for forming the electronic package. The electronic package has a first substrate including a first electronic device and including through-holes extending through an entire thickness of the first substrate. The electronic package has a second substrate bonded to the first substrate, metallizations formed in the through-holes of the first substrate to connect to components of the first electronic device, and a patternable substance disposed between the first substrate and the second substrate and adhering the first substrate and the second substrate together in regions apart from the metallizations. The method and system form through-holes extending through an entire thickness of the first substrate, deposit and pattern an adherable substance on the second substrate in a pattern having openings which expose connections for a second electronic device of the second substrate, align and attach the first substrate and the second substrate together, and form metallizations in the through-holes to connect to the connections for the second electronic device.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130129&amp;DB=EPODOC&amp;CC=US&amp;NR=8361901B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130129&amp;DB=EPODOC&amp;CC=US&amp;NR=8361901B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LUECK MATTHEW R</creatorcontrib><creatorcontrib>MALTA DEAN M</creatorcontrib><creatorcontrib>TEMPLE DOROTA</creatorcontrib><creatorcontrib>VICK ERIK P</creatorcontrib><title>Die bonding utilizing a patterned adhesion layer</title><description>An electronic package and method and system for forming the electronic package. The electronic package has a first substrate including a first electronic device and including through-holes extending through an entire thickness of the first substrate. The electronic package has a second substrate bonded to the first substrate, metallizations formed in the through-holes of the first substrate to connect to components of the first electronic device, and a patternable substance disposed between the first substrate and the second substrate and adhering the first substrate and the second substrate together in regions apart from the metallizations. The method and system form through-holes extending through an entire thickness of the first substrate, deposit and pattern an adherable substance on the second substrate in a pattern having openings which expose connections for a second electronic device of the second substrate, align and attach the first substrate and the second substrate together, and form metallizations in the through-holes to connect to the connections for the second electronic device.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBwyUxVSMrPS8nMS1coLcnMyawCsRIVChJLSlKL8lJTFBJTMlKLM_PzFHISK1OLeBhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJfGiwhbGZoaWBoZORMRFKAAbeKwM</recordid><startdate>20130129</startdate><enddate>20130129</enddate><creator>LUECK MATTHEW R</creator><creator>MALTA DEAN M</creator><creator>TEMPLE DOROTA</creator><creator>VICK ERIK P</creator><scope>EVB</scope></search><sort><creationdate>20130129</creationdate><title>Die bonding utilizing a patterned adhesion layer</title><author>LUECK MATTHEW R ; MALTA DEAN M ; TEMPLE DOROTA ; VICK ERIK P</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8361901B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><toplevel>online_resources</toplevel><creatorcontrib>LUECK MATTHEW R</creatorcontrib><creatorcontrib>MALTA DEAN M</creatorcontrib><creatorcontrib>TEMPLE DOROTA</creatorcontrib><creatorcontrib>VICK ERIK P</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LUECK MATTHEW R</au><au>MALTA DEAN M</au><au>TEMPLE DOROTA</au><au>VICK ERIK P</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Die bonding utilizing a patterned adhesion layer</title><date>2013-01-29</date><risdate>2013</risdate><abstract>An electronic package and method and system for forming the electronic package. The electronic package has a first substrate including a first electronic device and including through-holes extending through an entire thickness of the first substrate. The electronic package has a second substrate bonded to the first substrate, metallizations formed in the through-holes of the first substrate to connect to components of the first electronic device, and a patternable substance disposed between the first substrate and the second substrate and adhering the first substrate and the second substrate together in regions apart from the metallizations. The method and system form through-holes extending through an entire thickness of the first substrate, deposit and pattern an adherable substance on the second substrate in a pattern having openings which expose connections for a second electronic device of the second substrate, align and attach the first substrate and the second substrate together, and form metallizations in the through-holes to connect to the connections for the second electronic device.</abstract><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
SEMICONDUCTOR DEVICES
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
title Die bonding utilizing a patterned adhesion layer
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-21T00%3A25%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LUECK%20MATTHEW%20R&rft.date=2013-01-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8361901B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true