Aligned frontside backside laser dicing of semiconductor films

A method and system for dicing semiconductor devices from semiconductor thin films. A semiconductor film, backed by a metal layer, is bonded by an adhesive layer to a flexible translucent substrate. Reference features define device boundaries. An ultraviolet laser beam is aligned to the reference fe...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATTOS LAILA, PATTERSON DANIEL G, HE GANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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