Resin sealing structure for electronic component and resin sealing method for electronic component

An electronic component, in which the outer perimeter portion of a component (2) is surrounded with a first sealing resin (4), a second sealing resin (3) is filled within the periphery of the first sealing resin (4), the component (2) and a board (1) are electrically connected by a wire (5), the edg...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IMANISHI MAKOTO, KUMAZAWA KENTARO, TOMURA YOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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